Processes in N-channel Mosfets during postirradiation thermal annealing

被引:6
作者
Pejovic, M [1 ]
Jaksic, A [1 ]
Ristic, G [1 ]
Baljosevic, B [1 ]
机构
[1] FAC NAT SCI, YU-38000 PRISHTINA, YUGOSLAVIA
关键词
D O I
10.1016/S0969-806X(96)00181-8
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The processes during postirradiation thermal annealing of gamma-ray irradiated n-channel MOSFETs with both wet and dry gate oxides are investigated. For both analysed technologies, a so called ''latent'' interface trap buildup is observed, followed at very late annealing, times by the decrease in the interface-trap density. A model is proposed that successfully accounts for the experimental results. Implications of observed effects for total dose hardness assurance test methods implementation are discussed. (C) 1997 Elsevier Science Ltd.
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页码:521 / 525
页数:5
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