Mechanics of the micro cutting by abrasive particle at vibroabrasive processing

被引：0

作者：

Babichev, AP ^{[1
]}

机构：

[1] Don State Tech Univ, Rostov Na Donu 344010, Russia

来源：

ADVANCES IN ABRASIVE TECHNOLOGY VIII | 2005年 / 291-292卷

关键词：

vibroabrasive processing; abrasive granules; abrasive environment; vibratory influence; traces of the processing; physicochemical processes; deformation; stresses; contact platforms; adhesion; adsorption; micro relief; sub-micro relief; chip forming;

D O I：

10.4028/www.scientific.net/KEM.291-292.309

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The results of the research of the interaction of the abrasive granule with processed surface at vibroabrasive processing are presented. The mechanism of the micro cutting process is described on the base of the analysis of the nature of single traces of the processing, dynamic parameters of the process, geometric parameters of abrasive grains and granules.

引用

页码：309 / 314

页数：6