Interfacial microstructure of CuCr/1Cr18Ni9Ti bi-metal materials and its effect on bonding strength

被引：4

作者：

Zhang Qiao ^{[1
]}

Liang ShuHua ^{[1
]}

Zou JunTao ^{[1
]}

Yang Qing ^{[1
]}

机构：

[1] Xian Univ Technol, Shaanxi Prov Key Lab Elect Mat & Infiltrat Techno, Xian 710048, Peoples R China

来源：

SCIENCE CHINA-TECHNOLOGICAL SCIENCES | 2015年 / 58卷 / 05期

基金：

中国国家自然科学基金;

关键词：

solid-liquid bonding method; CuCr/1Cr18Ni9Ti bi-metal material; interface; microstructure; bonding strength; STAINLESS-STEEL; COPPER; ALUMINUM; JOINTS; ALLOY; CU;

D O I：

10.1007/s11431-015-5791-6

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The CuCr/1Cr18Ni9Ti bi-metal materials were prepared by the solid-liquid bonding method. The microstructures, mechanical properties and formation mechanism of the bonding interface were studied. The results show that there exists a serrated transition layer with a certain width at the interface of CuCr/1Cr18Ni9Ti bi-metal materials, and the transition layer consists of Fe-based and Cu-based solid solutions. The elastic modulus and hardness reach the maximum values at the interface closing to the 1Cr18Ni9Ti zone. The bonding temperature has a significant effect on the width and morphology of the transition layer. The interfacial bonding strength is at least 30% higher than that of the CuCr alloy, and the tensile fracture occurs at the side of the CuCr alloy rather than at the bonding interface.

引用

页码：825 / 831

页数：7

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