Thermal Imidization Kinetics of Ultrathin Films of Hybrid Poly(POSS-imide)s

被引:18
作者
Raaijmakers, Michiel J. T. [1 ]
Kappert, Emiel J. [1 ]
Nijmeijer, Arian [1 ]
Benes, Nieck E. [1 ]
机构
[1] Univ Twente, Dept Sci & Technol, MESA Inst Nanotechnol, Inorgan Membranes, NL-7500 AE Enschede, Netherlands
关键词
ACTIVATION-ENERGY; THIN-FILMS; DIELECTRIC-PROPERTIES; POSS NANOCOMPOSITES; POLYIMIDE FILMS; SPECTROSCOPY; COMPUTATIONS; TEMPERATURE; MECHANISMS; THICKNESS;
D O I
10.1021/acs.macromol.5b00473
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
In the thermal imidization of an alternating inorganic organic hybrid network, there is an inverse relationship between the length and flexibility of the organic bridges and the extent of the layer shrinkage. The hybrid Material studied here consists of,polyhedral oligomeric silsesquioxanes that are covalently bridged by amic acid groups. During heat treatment, shrinkage of the materials occurs due to the removal of physically bound water, imidization of the amic, acid groups, and silanol condensation: For five different bridging groups with different lengths and flexibilities, comparable mass reductions are observed. For the shorter bridging groups, the dimensional changes are hindered by the limited network mobility. Longer, more flexible bridging groups allow for much greater shrinkage. The imidization step can be,described by a decelerating reaction mechanisin with an onset at 150 degrees C and shows a higher activation energy than in the case of entirely organic polyimides. The differences in the imidization kinetics between hybrid and purely organic materials demonstrates the need for close study of the thermal processing of hybrid, hyper-cross-linked materials.
引用
收藏
页码:3031 / 3039
页数:9
相关论文
共 52 条
[11]   Polyimide/POSS nanocomposites: interfacial interaction, thermal properties and mechanical properties [J].
Huang, JC ;
He, CB ;
Xiao, Y ;
Mya, KY ;
Dai, J ;
Siow, YP .
POLYMER, 2003, 44 (16) :4491-4499
[12]   Temperature calibration procedure for thin film substrates for thermo-ellipsometric analysis using melting point standards [J].
Kappert, Emie J. ;
Raaijmakers, Michiel J. T. ;
Ogieglo, Wojciech ;
Nijmeijer, Arian ;
Huiskes, Cindy ;
Benes, Nieck E. .
THERMOCHIMICA ACTA, 2015, 601 :29-32
[13]   Mechanical and thermal properties of Polyimide/Silica hybrids with imide-modified silica network structures [J].
Khalil, Muhammad ;
Saeed, Shaukat ;
Ahmad, Zahoor .
JOURNAL OF APPLIED POLYMER SCIENCE, 2008, 107 (02) :1257-1268
[14]   Solid-state kinetic models: Basics and mathematical fundamentals [J].
Khawam, Ammar ;
Flanagan, Douglas R. .
JOURNAL OF PHYSICAL CHEMISTRY B, 2006, 110 (35) :17315-17328
[15]   Degree of imidization for polyimide films investigated by evolved gas analysis-mass spectrometry [J].
Kim, Byoung-Hyoun ;
Park, Huijung ;
Park, Heeyong ;
Moon, Dong Cheul .
THERMOCHIMICA ACTA, 2013, 551 :184-190
[16]   Effects of thermal curing on the structure of polyimide film [J].
Kim, SK ;
Kim, HT ;
Park, JK .
POLYMER JOURNAL, 1998, 30 (03) :229-233
[17]   KINETIC AND MECHANISTIC INVESTIGATIONS OF THE FORMATION OF POLYIMIDES UNDER HOMOGENEOUS CONDITIONS [J].
KIM, YJ ;
GLASS, TE ;
LYLE, GD ;
MCGRATH, JE .
MACROMOLECULES, 1993, 26 (06) :1344-1358
[18]   In situ measurements and analysis of imidization extent, thickness, and stress during the curing of polyimide films [J].
Kook, HJ ;
Kim, D .
JOURNAL OF MATERIALS SCIENCE, 2000, 35 (12) :2949-2954
[19]   A METHOD OF FINDING INVARIANT VALUES OF KINETIC-PARAMETERS [J].
LESNIKOVICH, AI ;
LEVCHIK, SV .
JOURNAL OF THERMAL ANALYSIS, 1983, 27 (01) :89-94
[20]   Synthesis and dielectric properties of polyimide-tethered polyhedral oligomeric silsesquioxane (POSS) nanocomposites via POSS-diamine [J].
Leu, CM ;
Chang, YT ;
Wei, KH .
MACROMOLECULES, 2003, 36 (24) :9122-9127