Key Enablers for 3D Sequential Integration

被引：0
|
作者：
Brunet, Laurent [1 ]
机构：
[1] Cea Leti, Grenoble, France
来源：
2016 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA) | 2016年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页数：1
相关论文
共 50 条
  • [41] Metrology for 3D Integration
    Allen, Richard A.
    Vartanian, Victor H.
    Read, David
    Baylies, Winthrop A.
    INTERNATIONAL SYMPOSIUM ON FUNCTIONAL DIVERSIFICATION OF SEMICONDUCTOR ELECTRONICS 2 (MORE-THAN-MOORE 2), 2014, 61 (06): : 105 - 112
  • [42] 3D monolithic integration
    Batude, P.
    Vinet, M.
    Pouydebasque, A.
    Le Royer, C.
    Previtali, B.
    Tabone, C.
    Hartmann, J. -M.
    Sanchez, L.
    Baud, L.
    Carron, V.
    Toffoli, A.
    Allain, F.
    Mazzocchi, V.
    Lafond, D.
    Deleonibus, S.
    Faynot, O.
    2011 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2011, : 2233 - 2236
  • [43] 3D system integration
    Klumpp, Armin
    Merkel, Reinhard
    Ramm, Peter
    Wieland, Robert
    2007 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PAPERS, 2007, : 70 - +
  • [44] 3d integration for introspection
    Mysore, Shashidhar
    Agrawal, Banit
    Srivastava, Navin
    Lin, Sheng-Chih
    Banerjee, Kaustav
    Sherwood, Timothy
    IEEE MICRO, 2007, 27 (01) : 77 - 83
  • [45] Breakthroughs in 3D Sequential technology
    Brunet, L.
    Fenouillet-Beranger, C.
    Batude, P.
    Beaurepaire, S.
    Ponthenier, F.
    Rambal, N.
    Mazzocchi, V.
    Pin, J-B.
    Acosta-Alba, P.
    Kerdiles, S.
    Besson, P.
    Fontaine, H.
    Lardin, T.
    Fournel, F.
    Larrey, V.
    Mazen, F.
    Balan, V.
    Morales, C.
    Guerin, C.
    Jousseaume, V.
    Federspiel, X.
    Ney, D.
    Garros, X.
    Roman, A.
    Scevola, D.
    Perreau, P.
    Kouemeni-Tchouake, F.
    Arnaud, L.
    Scibetta, C.
    Chevalliez, S.
    Aussenac, F.
    Aubin, J.
    Reboh, S.
    Andrieu, F.
    Maitrejean, S.
    Vinet, M.
    2018 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2018,
  • [46] Key Process Development on 300mm Wafer for 2.5D/3D Integration
    Song, Chongshen
    Xue, Kai
    Jiang, Feng
    Li, Hengfu
    Feng, Guangjian
    Jing, Xiangmeng
    Zhang, W.
    PROCEEDINGS OF THE 2015 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2015, : 241 - 244
  • [47] Heterogeneous 3D Integration Technology and New 3D LSIs
    Koyanagi, Mitsumasa
    Lee, Kang-Wook
    Fukushima, Takafumi
    Tanaka, Tetsu
    2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012), 2012, : 240 - 243
  • [48] 3D Integration Technology for 3D Stacked Retinal Chip
    Kaiho, Y.
    Ohara, Y.
    Takeshita, H.
    Kiyoyama, K.
    Lee, K-W
    Tanaka, T.
    Koyanagi, M.
    2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION, 2009, : 211 - +
  • [49] New 3D Integration Technology and 3D System LSIs
    Koyanagi, Mitsumasa
    2009 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2009, : 64 - 67
  • [50] Methodology for thermal budget reduction of SPER down to 450 °C for 3D sequential integration
    Luce, F. P.
    Pasini, L.
    Sklenard, B.
    Mathieu, B.
    Licitra, C.
    Batude, P.
    Mazen, F.
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2016, 370 : 14 - 18
12345