High Performance in a Normally-off Al2O3/GaN MOSFET Based on an AlGaN/GaN Heterostructure with a p-GaN Buffer Layer

被引:9
作者
Kim, Dong-Seok [1 ]
Kim, Sung-Nam [1 ]
Kim, Ki-Won [1 ]
Im, Ki-Sik [1 ]
Kang, Hee-Sung [1 ]
Kwak, Eun-Hwan [1 ]
Lee, Jung-Hee [1 ]
Lee, Seong-Gil [2 ]
Ha, Jong-Bong [3 ]
机构
[1] Kyungpook Natl Univ, Sch Elect Engn & Comp Sci, Taegu 702701, South Korea
[2] Kyungpook Natl Univ, Dept Sensor & Display Engn, Taegu 702701, South Korea
[3] Samsung Elect Co Ltd, Samsung Adv Inst Technol, Mat & Device Res Ctr, Yongin 446712, South Korea
关键词
Normally-off; AlGaN/GaN; MOSFET; p-GaN; ALD; Al2O3; FIELD-EFFECT-TRANSISTOR; DEPOSITED AL2O3; OPERATION; HEMTS; OXIDE;
D O I
10.3938/jkps.58.1500
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
An AlGaN/GaN-based normally-off GaN metal-oxide-semiconductor field-effect transistor (MOSFET) with a p-GaN buffer layer and using an over-recessed gate structure has been demonstrated for the first time. The p-GaN buffer layer is believed to have advantages of not only ensuring a fairly positive threshold voltage due to the depletion effect but also reducing the buffer leakage current. The over-recessed gate region and the whole surface of the AlGaN layer were covered with a high-quality atomic layer-deposited (ALD) Al2O3 layer, which play a role as an excellent gate insulator in the recessed gate region and a surface passivation layer in the ungated region between the source and the drain. The fabricated GaN MOSFET with 30-nm-thick ALD Al2O3 exhibited good device performances, such as a maximum drain current of 109 mA/mm, a maximum extrinsic transconductance of 30 mS/mm, a low specific on-resistance of 1.86 m Omega.cm(2), and a subthreshold slope of 365 mV/dec with a threshold voltage of 2.6 V.
引用
收藏
页码:1500 / 1504
页数:5
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