Thermal Properties of SiCp/Al Composites Consolidated by Equal Channel Angular Pressing and Torsion

Powder mixture of pure Al and oxidized SiC was consolidated into SiCp/Al composites by equal channel angular pressing and torsion (ECAP-T). The influences of several parameters on the thermal expansions, the thermal conductivities, and the recrystallization temperatures of the as-consolidated composites were studied. These parameters are the number of ECAP-T passes (1, 2, and 4), the content of SiC (10, 20, and 40 wt.%), and the fabrication temperature (150, 250, and 350 A degrees C). The results show that increasing the number of ECAP-T passes has a positive effect on depressing the coefficient of thermal expansion (CTE) of the composite within a certain temperature range, since the total variation amplitude of the CTE is enlarged. The CTE can also be decreased by increasing the content of SiC. The number of ECAP-T passes and the contents of SiC in the composites are both positively related with the thermal conductivity of the composites. No direct relationship between the fabrication temperature and the thermal properties was detected. However, the composite fabricated at too low temperature (150 A degrees C) can not obtain full densification, leading to the appearance of low CTE and thermal conductivity. Finally, when the number of ECAP-T passes is elevated from 2 to 4, the recrystallization temperature of the composite has an obvious declination.