On the electrochemical migration mechanism of tin in electronics

被引：111

作者：

Minzari, Daniel ^{[1
]}

Jellesen, Morten S. ^{[1
]}

Moller, Per ^{[1
]}

Ambat, Rajan ^{[1
]}

机构：

[1] Tech Univ Denmark, Dept Mech Engn, DK-2800 Lyngby, Denmark

来源：

CORROSION SCIENCE | 2011年 / 53卷 / 10期

关键词：

Tin; Potentiostatic; Electrochemical migration; Dendrite; ELECTROLYTIC COPPER DENDRITES; SILVER MIGRATION; GROWTH; CORROSION; SOLDER;

D O I：

10.1016/j.corsci.2011.06.015

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Electrochemical migration (ECM) of tin can result in the growth of a metal deposit with a dendritic structure from cathode to anode. In electronics, such growth can lead to short circuit of biased electrodes, potentially leading to intermittent or complete failure of an electronic device. In this paper, mechanistic aspects of ECM of tin are discussed in detail, using experimental results on ECM of tin in various environments and varying potential bias. Results on the formation of local pH changes by the electrodes and experiments observations are combined with thermodynamic stability of tin species as depicted in the Pourbaix diagram. (C) 2011 Elsevier Ltd. All rights reserved.

引用

页码：3366 / 3379

页数：14

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