Suppression of short-channel effects in normally-off GaN MOSFETs with deep recessed-gate structures

被引:10
作者
Kato, Daimotsu [1 ]
Kajiwara, Yosuke [1 ]
Mukai, Akira [1 ]
Ono, Hiroshi [1 ]
Shindome, Aya [1 ]
Tajima, Jumpei [1 ]
Hikosaka, Toshiki [1 ]
Kuraguchi, Masahiko [1 ]
Nunoue, Shinya [1 ]
机构
[1] Toshiba Co Ltd, Corp Res & Dev Ctr, Saiwai Ku, 1 Komukai Toshiba Cho, Kawasaki, Kanagawa 2128582, Japan
关键词
ALGAN/GAN HEMTS; VOLTAGE; OPERATION; TRANSISTORS;
D O I
10.35848/1347-4065/ab6b7f
中图分类号
O59 [应用物理学];
学科分类号
摘要
We have demonstrated the suppression of short-channel effects (SCEs) in normally-off GaN metal-oxide-semiconductor field-effect transistors (MOSFETs) with deep recessed-gate structures. TCAD simulation results show that the electric field concentration is effectively reduced at the recessed edge of MOSFETs with deeper recessed-gate structures. To demonstrate suppression of SCEs, MOSFET gate structures with recess depths ranging from 45 to 165 nm were fabricated and evaluated. Experimental results show that deeper recessed-gate structures are highly effective for suppressing drain-induced barrier lowering and improving subthreshold swing and threshold voltage roll-off. (C) 2020 The Japan Society of Applied Physics
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页数:5
相关论文
共 39 条
[1]   Gallium nitride devices for power electronic applications [J].
Baliga, B. Jayant .
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2013, 28 (07)
[2]   Performance evaluation of channel length downscaling of various high voltage AlGaN/GaN power HEMTs [J].
Guo, Zhibo ;
Chow, T. Paul .
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2015, 212 (05) :1137-1144
[3]   Al2O3 insulated-gate structure for AlGaN/GaN heterostructure field effect transistors having thin AlGaN barrier layers [J].
Hashizume, T ;
Anantathanasarn, S ;
Negoro, N ;
Sano, E ;
Hasegawa, H ;
Kumakura, K ;
Makimoto, T .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2004, 43 (6B) :L777-L779
[4]   Evaluation and Application of 600 V GaN HEMT in Cascode Structure [J].
Huang, Xiucheng ;
Liu, Zhengyang ;
Li, Qiang ;
Lee, Fred C. .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2014, 29 (05) :2453-2461
[5]   Interfacial charge effects on electron transport in III-Nitride metal insulator semiconductor transistors [J].
Hung, Ting-Hsiang ;
Esposto, Michele ;
Rajan, Siddharth .
APPLIED PHYSICS LETTERS, 2011, 99 (16)
[6]   Short-channel effect limitations on high-frequency operation of AlGaN/GaN HEMTs for T-Gate devices [J].
Jessen, Gregg H. ;
Fitch, Robert C., Jr. ;
Gillespie, James K. ;
Via, Glen ;
Crespo, Antonio ;
Langley, Derrick ;
Denninghoff, Daniel J. ;
Trejo, Manuel, Jr. ;
Heller, Eric R. .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2007, 54 (10) :2589-2597
[7]   Review of Commercial GaN Power Devices and GaN-Based Converter Design Challenges [J].
Jones, Edward A. ;
Wang, Fei ;
Costinett, Daniel .
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2016, 4 (03) :707-719
[8]  
Kachi T, 2012, 2012 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)
[9]  
Kajiwara Y., 2018, INT WORKSH NITR SEM
[10]   Normally off n-channel GaN MOSFETs on Si substrates using an SAG technique and ion implantation [J].
Kambayashi, Hiroshi ;
Niiyama, Yuki ;
Ootomo, Shinya ;
Nomura, Takehiko ;
Iwami, Masayuki ;
Satoh, Yoshihiro ;
Kato, Sadahiro ;
Yoshida, Seikoh .
IEEE ELECTRON DEVICE LETTERS, 2007, 28 (12) :1077-1079