Stress evolution during thermoset cure

被引：1

作者：

Mei, YH ^{[1
]}

Yee, AF ^{[1
]}

Wineman, AS ^{[1
]}

Xiao, CD ^{[1
]}

机构：

[1] Univ Michigan, Dept Mech Engn & Appl Mech, Ann Arbor, MI 48109 USA

来源：

ELECTRONIC PACKAGING MATERIALS SCIENCE X | 1998年 / 515卷

关键词：

D O I：

10.1557/PROC-515-195

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The residual stress evolution in an epoxy during isothermal curing process has been determined experimentally. It was found that for a certain curing temperature range in which the characteristic time for the molecular motions leading to volume recovery is shorter than the time scale of the experiment, an incremental elastic constitutive equation can be used to describe the mechanical response of the epoxy. It was also found that appreciable residual stresses are developed in a three-dimensionally constrained epoxy resin system within the rubbery state.

引用

页码：195 / 202

页数：8

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