Gas rarefaction effects during high power pulsed magnetron sputtering of groups IVb and VIb transition metals in Ar

The authors use energy- and time-dependent mass spectrometry to analyze the evolution of metal- and gas-ion fluxes incident at the substrate during high-power pulsed magnetron sputtering (HiPIMS) of groups IVb and VIb transition-metal (TM) targets in Ar. For all TMs, the time-and energy-integrated metal/gas-ion ratio at the substrate plane NMe+/NAr+ increases with increasing peak target current density J(T,peak) due to rarefaction. In addition, NMe+/NAr+ exhibits a strong dependence on metal/gas-atom mass ratio m(Me)/m(g) and varies from similar to 1 for Ti (m(Ti)/m(Ar) = 1.20) to similar to 100 for W (m(W)/m(Ar) = 4.60), with J(T,peak) maintained constant at 1 A/cm(2). Time-resolved ion-energy distribution functions confirm that the degree of rarefaction scales with m(Me)/m(g): for heavier TMs, the original sputtered-atom Sigmund-Thompson energy distributions are preserved long after the HiPIMS pulse, which is in distinct contrast to lighter metals for which the energy distributions collapse into a narrow thermalized peak. Hence, precise timing of synchronous substrate-bias pulses, applied in order to reduce film stress while increasing densification, is critical for metal/gas combinations with m(Me)/m(g) near unity, while with m(Me)/m(g) >> 1, the width of the synchronous bias pulse is essentially controlled by the metal-ion time of flight. The good agreement between results obtained in an industrial system employing 440 cm(2) cathodes and a laboratory-scale system with a 20 cm(2) target is indicative of the fundamental nature of the phenomena. (C) 2017 American Vacuum Society.