Growth Mechanism of Oxygen-Containing Functional Plasma Polymers

被引：60

作者：

Hegemann, D. ^{[1
]}

Koerner, E. ^{[1
]}

Albrecht, K. ^{[1
]}

Schuetz, U. ^{[1
]}

Guimond, S. ^{[1
]}

机构：

[1] Empa, Swiss Fed Labs Mat Testing & Res, CH-9014 St Gallen, Switzerland

来源：

PLASMA PROCESSES AND POLYMERS | 2010年 / 7卷 / 11期

关键词：

ablation; deposition; R F plasma; specific energy; RADIO-FREQUENCY DISCHARGE; MACROSCOPIC KINETICS; MICROWAVE PLASMA; ENERGY-DISTRIBUTION; C-H; SURFACE; POLYMERIZATION; ION; DEPOSITION; FILMS;

D O I：

10.1002/ppap.200900144

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Regarding the recent debate on the usefulness of macroscopic kinetics for plasma polymerization, we further investigated the deposition of oxygen-containing functional plasma polymers based on low pressure CO2/C2H4 RF discharges in order to find differences and transitions in the growth mechanism. A reduction in deposition rate with increasing CO2/C2H4 ratio and a drop in deposition rate at enhanced energy input have been observed. Both effects are found to be mainly related to plasma-chemical processes such as the production of film-forming species and oxidation in the gas phase. In contrast to plasma etching with non-polymerizing gases, ion-enhanced etching effects were found to play a secondary role for the deposition of oxygen-containing functional plasma polymers.

引用

页码：889 / 898

页数：10

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