Numerical study on heat transfer performance using Al2O3/water nanofluids in six circular channel heat sink for electronic chip

被引：43

作者：

Kumar, P. C. Mukesh ^{[1
]}

Kumar, C. M. Arun ^{[2
]}

机构：

[1] Univ Coll Engn, Dept Mech Engn, Dindigul 624622, Tamil Nadu, India

[2] Univ Coll Engn, Dept Elect & Commun Engn, Pattukottai 614701, Tamil Nadu, India

来源：

MATERIALS TODAY-PROCEEDINGS | 2020年 / 21卷

关键词：

Al2O3/water nanofluid; Electronic cooling; ANSYS-fluent; Micro channel heat sink; Reynolds number; THERMAL PERFORMANCE; PRESSURE-DROP; FLOW;

D O I：

10.1016/j.matpr.2019.04.220

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this numerical study, the heat transfer rate, surface temperature, Nusselt number, thermal resistance, power consumption and reliability of electronic chip in the six circular channel heat sink are investigated with water and the Al2O3/water nanofluids as coolants. The performances of electronic chip are studied with the ANSYS (v12) fluent software. It is observed that the Al2O3/water nanofluids decreases the surface temperature, the power consumption, and thermal resistance of electronic chip than water. It is also studied that the Nusselt number increases and the reliability of electronic chip using nanofluids is 70% higher than water as coolant. (C) 2019 Elsevier Ltd. All rights reserved.

引用

页码：194 / 201

页数：8

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