Novel Oxide-Passivated AlGaN/GaN HEMT by Using Hydrogen Peroxide Treatment

被引:31
作者
Liu, Han-Yin [1 ]
Chou, Bo-Yi [1 ]
Hsu, Wei-Chou [1 ]
Lee, Ching-Sung [2 ]
Ho, Chiu-Sheng [1 ]
机构
[1] Natl Cheng Kung Univ, Dept Elect Engn, Inst Microelect, Adv Optoelect Technol Ctr, Tainan 70101, Taiwan
[2] Feng Chia Univ 100, Dept Elect Engn, Taichung 40724, Taiwan
关键词
AlGaN/GaN high-electron mobility transistor (HEMT); H2O2; treatment; surface passivation; ELECTRON-MOBILITY TRANSISTORS; SURFACE PASSIVATION; PERFORMANCE;
D O I
10.1109/TED.2011.2167512
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This brief reports, for the first time, an oxide-passivated AlGaN/GaN high electron mobility transistor by using the hydrogen peroxide (H2O2) treatment. Characterizations by using electron spectroscopy for chemical analysis and transmission electron microscopy have been performed to verify the formation of surface oxide on the AlGaN barrier layer. The present design has demonstrated superior improvements of 41% in the maximum drain/source current density I-DS,I-max, 39% in the drain/source saturation current density at zero gate bias I-DSS0, 47% in the maximum extrinsic transconductance g(m, max), 53.2% in the two-terminal gate/drain breakdown voltage BVGD, 36% in the cutoff frequency f(T), and 20% in the maximum oscillation frequency f(max), as compared with an unpassivated conventional device.
引用
收藏
页码:4430 / 4433
页数:4
相关论文
共 18 条
[1]   Scattering mechanisms limiting two-dimensional electron gas mobility in Al0.25Ga0.75N/GaN modulation-doped field-effect transistors [J].
Antoszewski, J ;
Gracey, M ;
Dell, JM ;
Faraone, L ;
Fisher, TA ;
Parish, G ;
Wu, YF ;
Mishra, UK .
JOURNAL OF APPLIED PHYSICS, 2000, 87 (08) :3900-3904
[2]   Effect of gate-source and gate-drain Si3N4 passivation on current collapse in AlGaN/GaN high-electron-mobility transistors on silicon [J].
Arulkumaran, S. ;
Ng, G. I. ;
Liu, Z. H. .
APPLIED PHYSICS LETTERS, 2007, 90 (17)
[3]   Comparative study of drain-current collapse in AlGaN/GaN high-electron-mobility transistors on sapphire and semi-insulating SiC [J].
Arulkumaran, S ;
Egawa, T ;
Ishikawa, H ;
Jimbo, T .
APPLIED PHYSICS LETTERS, 2002, 81 (16) :3073-3075
[4]   EXPERIMENTAL STUDIES ON 1-F NOISE [J].
HOOGE, FN ;
KLEINPENNING, TGM ;
VANDAMME, LKJ .
REPORTS ON PROGRESS IN PHYSICS, 1981, 44 (05) :479-532
[5]   Passivation effects of 100nm In0.4AlAs/In0.35 GaAs metamorphic high-electron-mobility transistors with a silicon nitride layer by remote plasma-enhanced chemical vapor deposition [J].
Kim, Sungwon ;
Jang, Kyoungchul ;
Seol, Gyungseon ;
Her, Jincherl ;
Seo, Kwangseok .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2007, 46 (4B) :2341-2343
[6]  
Ladbrooke P. H., 1991, MMIC DESIGN GAAS FET, P160
[7]   Γ-Gate MOS-HEMTs by Methods of Ozone Water Oxidation and Shifted Exposure [J].
Lee, Ching-Sung ;
Yang, Sheng-Han ;
Lin, Ming-Yuan .
IEEE ELECTRON DEVICE LETTERS, 2011, 32 (02) :152-154
[8]   SiN-passivated Γ-gate Al0.27Ga0.73N/GaN high electron mobility transistors by using a shifted exposure method [J].
Lee, Ching-Sung ;
Kao, An-Yung .
APPLIED PHYSICS LETTERS, 2009, 95 (09)
[9]   Investigation of a Metal-Insulator-Semiconductor Pt/Mixed Al2O3 and Ga2O3 Insulator/AlGaN Hydrogen Sensor [J].
Lee, Ching-Ting ;
Yan, Jheng-Tai .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2010, 157 (08) :J281-J284
[10]   Electrical characteristics of temperature-difference liquid phase deposited SiO2 on GaN with (NH4)2Sx treatment [J].
Lee, Ming-Kwei ;
Ho, Chen-Lin ;
Zeng, Jia-Yi .
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2008, 205 (11) :2679-2682