Vibrational spectroscopy of low-k/ultra-low-k dielectric materials on patterned wafers

被引:13
作者
Lam, Jeffrey C. K. [1 ]
Huang, Maggie Y. M. [1 ]
Tan, Hao [1 ]
Mo, Zhiqiang [1 ]
Mai, Zhihong [1 ]
Wong, Choun Pei [2 ]
Sun, Handong [2 ]
Shen, Zexiang [2 ]
机构
[1] Globalfoundries Singapore Pte Ltd, Singapore 738406, Singapore
[2] Nanyang Technol Univ, Sch Phys & Math Sci, Div Phys & Appl Phys, Singapore 637371, Singapore
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | 2011年 / 29卷 / 05期
关键词
CHEMICAL-VAPOR-DEPOSITION; THIN-FILMS; CONSTANT; RAMAN;
D O I
10.1116/1.3625099
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Comparing with much valuable research on vibrational spectroscopy on low-k dielectrics in different substrates, this paper investigates the vibrational spectroscopy of low-k and ultra-low-k dielectric materials on patterned wafers. It is found that both Raman and FTIR spectroscopy are necessary as complement to characterize low-k and ultra-low-k dielectric materials on patterned wafers. Significant differences in the Raman and FTIR spectra between low-k and ultra-low-k dielectric materials are also observed. Moreover, Raman spectroscopy has an advantage in analyzing the mixed structure of low-k/ultra-low-k and Cu at nanometer-scaled sizes. The results in this paper show that Raman combined with FTIR spectroscopy is an effective tool to characterize dielectric thin film properties on patterned wafers. (C) 2011 American Vacuum Society. [DOI: 10.1116/1.3625099]
引用
收藏
页数:6
相关论文
共 28 条
[1]   Diamond-like carbon thin films for high-temperature applications prepared by filtered pulsed laser deposition [J].
Balon, F ;
Stolojan, V ;
Silva, SRP ;
Michalka, M ;
Kromka, A .
VACUUM, 2005, 80 (1-3) :163-167
[2]   Mechanistic study of plasma damage of low k dielectric surfaces [J].
Bao, J. ;
Shi, H. ;
Liu, J. ;
Huang, H. ;
Ho, P. S. ;
Goodner, M. D. ;
Moinpour, M. ;
Kloster, G. M. .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2008, 26 (01) :219-226
[3]   Vibrational properties of polysiloxanes: from dimer to oligomers and polymers. 1. Structural and vibrational properties of hexamethyldisiloxane (CH3)3SiOSi(CH3)3 [J].
Carteret, C. ;
Labrosse, A. .
JOURNAL OF RAMAN SPECTROSCOPY, 2010, 41 (09) :996-1004
[4]   Analysis of HSG-7000 silsesquioxane-based low-k dielectric hot plate curing using Raman spectroscopy [J].
Doux, C ;
Aw, KC ;
Niewoudt, M ;
Gao, W .
MICROELECTRONIC ENGINEERING, 2006, 83 (02) :387-391
[5]   OPTICAL PROPERTIES OF AG AND CU [J].
EHRENREICH, H ;
PHILIPP, HR .
PHYSICAL REVIEW, 1962, 128 (04) :1622-+
[6]   Integration of benzocyclobutene polymers and silicon micromachined structures using anisotropic wet etching [J].
Ghalichechian, N ;
Modafe, A ;
Ghodssi, R ;
Lazzeri, P ;
Micheli, V ;
Anderle, M .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2004, 22 (05) :2439-2447
[7]   Structure of low dielectric constant to extreme low dielectric constant SiCOH films: Fourier transform infrared spectroscopy characterization [J].
Grill, A ;
Neumayer, DA .
JOURNAL OF APPLIED PHYSICS, 2003, 94 (10) :6697-6707
[8]   Ultralow-k dielectrics prepared by plasma-enhanced chemical vapor deposition [J].
Grill, A ;
Patel, V .
APPLIED PHYSICS LETTERS, 2001, 79 (06) :803-805
[9]   Cu penetration into low-k dielectric during deposition and bias-temperature stress [J].
He, Ming ;
Novak, Steven ;
Vanamurthy, Lakshmanan ;
Bakhru, Hassaram ;
Plawsky, Joel ;
Lu, Toh-Ming .
APPLIED PHYSICS LETTERS, 2010, 97 (25)
[10]   Plasma-surface interactions of nanoporous silica during plasma-based pattern transfer using C4F8 and C4F8/Ar gas mixtures [J].
Hua, XF ;
Stolz, C ;
Oehrlein, GS ;
Lazzeri, P ;
Coghe, N ;
Anderle, M ;
Inoki, CK ;
Kuan, TS ;
Jiang, P .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2005, 23 (01) :151-164