Electric Field Driven Degradation of AlGaN/GaN High Electron Mobility Transistors during Off-State Stress

被引:0
作者
Chang, C. Y. [1 ]
Douglas, E. A. [1 ]
Kim, J. [2 ]
Liu, L. [3 ]
Lo, C. F.
Chu, B. H. [3 ]
Cheney, D. J. [4 ]
Gila, B. P.
Ren, F. [3 ]
Via, G. D. [5 ]
Cullen, D. A. [6 ]
Zhou, L. [7 ]
Smith, D. J. [7 ]
Jang, S.
Pearton, S. J. [1 ]
机构
[1] Univ Florida, Dept Mat Sci & Engn, Gainesville, FL 32611 USA
[2] Dankook Univ, Dept Chem Engn, Yongin 448701, South Korea
[3] Univ Florida, Dept Chem Engn, Gainesville, FL 32611 USA
[4] Univ Florida, Dept Elect & Comp Engn, Gainesville, FL 32611 USA
[5] Air Force Res Lab, Wright Patterson AFB, OH 45433 USA
[6] Oak Ridge Natl Lab, Mat Sci & Technol Div, Oak Ridge, TN 37831 USA
[7] Arizona State Univ, Dept Phys, Tempe, AZ 85287 USA
来源
STATE-OF-THE-ART PROGRAM ON COMPOUND SEMICONDUCTORS 53 (SOTAPOCS 53) | 2011年 / 41卷 / 06期
关键词
RF; RELIABILITY; VOLTAGE; IMPACT;
D O I
10.1149/1.3629957
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The critical degradation voltage of AlGaN/GaN High Electron Mobility Transistors with Ni/Au gate during off-state electrical stress was studied. Devices with different gate length and gate-drain distances were found to exhibit the onset of degradation at different source-drain biases but similar electric field strengths, showing that the degradation mechanism is primarily field-driven. The calculated degradation field was similar to 1.8MV/cm by ATLAS simulations. Transmission Electron Microscopy imaging showed creation of defects under the gate after DC stress.
引用
收藏
页码:89 / 100
页数:12
相关论文
共 23 条
[1]   Evaluation and Numerical Simulations of GaN HEMTs Electrical Degradation [J].
Chini, Alessandro ;
Di Lecce, Valerio ;
Esposto, Michele ;
Meneghesso, Gaudenzio ;
Zanoni, Enrico .
IEEE ELECTRON DEVICE LETTERS, 2009, 30 (10) :1021-1023
[2]   TEM observation of crack- and pit-shaped defects in electrically degraded GaNHEMTs [J].
Chowdhury, Uttiya ;
Jimenez, Jose L. ;
Lee, Cathy ;
Beam, Edward ;
Saunier, Paul ;
Balistreri, Tony ;
Park, Seong-Yong ;
Lee, Taehun ;
Wang, J. ;
Kim, Moon J. ;
Joh, Jungwoo ;
del Alamo, Jesus A. .
IEEE ELECTRON DEVICE LETTERS, 2008, 29 (10) :1098-1100
[3]   TEMPERATURE AND VOLTAGE DEPENDENT RF DEGRADATION STUDY IN ALGAN/GAN HEMTS [J].
Coffie, R. ;
Chen, Y. ;
Smorchkova, I. P. ;
Heying, B. ;
Gambin, V. ;
Sutton, W. ;
Chou, Y. -C. ;
Luo, W. -B. ;
Wojtowicz, M. ;
Oki, A. .
2007 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 45TH ANNUAL, 2007, :568-+
[4]   Accelerated RF life testing of GaNHFETs [J].
Conway, A. M. ;
Chen, M. ;
Hashimoto, P. ;
Willadsen, P. J. ;
Micovic, M. .
2007 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 45TH ANNUAL, 2007, :472-+
[5]   GaN HEMT reliability [J].
del Alamo, J. A. ;
Joh, J. .
MICROELECTRONICS RELIABILITY, 2009, 49 (9-11) :1200-1206
[6]   Investigation of high-electric-field degradation effects in AlGaN/GaN HEMTs [J].
Faqir, Mustapha ;
Verzellesi, Giovanni ;
Meneghesso, Gaudenzio ;
Zanoni, Enrico ;
Fantini, Fausto .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2008, 55 (07) :1592-1602
[7]   Mechanism of anomalous current transport in n-type GaN Schottky contacts [J].
Hasegawa, H ;
Oyama, S .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2002, 20 (04) :1647-1655
[8]  
Inoue Y, 2007, IEEE MTT-S, P638
[9]  
Jimenez J. L., 2006, P ROCS MAY, P78
[10]  
Joh J., 2006, IEDM, P415, DOI DOI 10.1109/IEDM.2006.346799