Material removal behavior and crack-inhibiting effect in ultrasonic vibration-assisted scratching of silicon nitride ceramics

被引：42

作者：

Qiao, Guochao ^{[1
]}

Yi, Shicheng ^{[1
]}

Zheng, Wei ^{[2
]}

Zhou, Ming ^{[3
]}

机构：

[1] Hebei Univ Technol, Sch Mech Engn, Tianjin 300401, Peoples R China

[2] Beijing Inst Astronaut Syst Engn, Beijing 100070, Peoples R China

[3] Harbin Inst Technol, Sch Mech & Elect Engn, Harbin 150001, Peoples R China

来源：

CERAMICS INTERNATIONAL | 2022年 / 48卷 / 03期

基金：

中国国家自然科学基金;

关键词：

Ultrasonic-assisted scratching; Crack-inhibiting effect; Material removal mechanism; Brittle-ductile transition; Ceramics; BRITTLE-DUCTILE TRANSITION; PLASTIC INDENTATION DAMAGE; SURFACE CHARACTERISTICS; SUBSURFACE DAMAGE; PREDICTIVE MODEL; OPTICAL-GLASS; MECHANISM; PROPAGATION; CARBIDE;

D O I：

10.1016/j.ceramint.2021.10.229

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

To investigate the material removal mechanism and crack-inhibiting effect of ultrasonic vibration-assisted grinding of ceramic materials, a series of double-scratch tests with variable scratching depths and interval distances was conducted. Ultrasonic vibration-assisted scratching (UVS) and conventional scratching (CS) were compared in terms of cutting force, scratch morphology, crack system, and material removal mode, and the effects of ultrasonic vibration and scratch interval distance on the material removal mode and crack-inhibiting effect were analyzed. The results indicate that the crack-inhibiting effect between scratches gradually decreases with an increase in the scratch interval distance. In comparison with CS, UVS can increase the critical load of the brittle-ductile transition and promote the propagation of shallow lateral cracks to the surface. Meanwhile, ultrasonic vibration increases the critical scratch interval distance of the crack-inhibiting effect. The research results also reveal that the material is mostly removed by the interlacing of shallow lateral cracks in UVS; however, this is due to the combined action of deep lateral cracks and radial cracks in CS.

引用

页码：4341 / 4351

页数：11

共 39 条

[1] Grinding characteristics, material removal and damage formation mechanisms in high removal rate grinding of silicon carbide [J].

Agarwal, Sanjay ;

Rao, P. Venkateswara .

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2010, 50 (12) :1077-1087

[2] A predictive model of the critical undeformed chip thickness for ductile-brittle transition in nano-machining of brittle materials [J].

Arif, Muhammad ;

Zhang Xinquan ;

Rahman, Mustafizur ;

Kumar, Senthil .

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2013, 64 :114-122

[3] Investigation on rotary ultrasonic assisted end grinding of silicon nitride ceramics [J].

Baraheni, Mohammad ;

Amini, Saeid .

SN APPLIED SCIENCES, 2019, 1 (12)

[4] Predicting subsurface damage in silicon nitride ceramics subjected to rotary ultrasonic assisted face grinding [J].

Baraheni, Mohammad ;

Amini, Saeid .

CERAMICS INTERNATIONAL, 2019, 45 (08) :10086-10096

[5] Theoretical study on brittle-ductile transition behavior in elliptical ultrasonic assisted grinding of hard brittle materials [J].

Chen, J. B. ;

Fang, Q. H. ;

Wang, C. C. ;

Du, J. K. ;

Liu, F. .

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2016, 46 :104-117

[6] The critical conditions of brittle-ductile transition and the factors influencing the surface quality of brittle materials in ultra-precision grinding [J].

Chen, MJ ;

Zhao, QL ;

Dong, S ;

Li, D .

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2005, 168 (01) :75-82

[7] Rotary ultrasonic machining of CFRP: A mechanistic predictive model for cutting force [J].

Cong, W. L. ;

Pei, Z. J. ;

Sun, X. ;

Zhang, C. L. .

ULTRASONICS, 2014, 54 (02) :663-675

[8] Ultrasonic assisted grinding of advanced materials for biomedical and aerospace applications-a review [J].

Dambatta, Yusuf S. ;

Sarhan, Ahmed A. D. ;

Sayuti, M. ;

Hamdi, M. .

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2017, 92 (9-12) :3825-3858

[9] Formation mechanism and modelling of exit edge-chipping during ultrasonic vibration grinding of deep-small holes of microcrystalline-mica ceramics [J].

Dong, Guojun ;

Lang, Chenyang ;

Li, Chen ;

Zhang, Liming .

CERAMICS INTERNATIONAL, 2020, 46 (08) :12458-12469

[10] Investigation on grinding force and machining quality during rotary ultrasonic grinding deep-small hole of fluorophlogopite ceramics [J].

Dong, Guojun ;

Zhang, Liming .

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2019, 104 (5-8) :2815-2825

← 1 2 3 4 →