Microstructure evolution of Cu-1.0Co-0.65Si-0.1Ti alloy during hot deformation

The Cu-1.0Co-0.65Si-0.1Ti alloy was obtained by vacuum melting, and then the hot deformation experiment was carried out by using the Gleeble-1500 simulator at 0.001-10 s(-1) strain rates and 500-900 degrees C deformation temperatures. The microstructure evolution of Cu-1.0Co-0.65Si-0.1Ti alloy was discussed. The micro texture of Cu-1.0Co-0.65Si-0.1Ti alloy was analyzed by EBSD. With the deformation temperature increasing from 700 to 800 degrees C, the dynamic recrystallization was promoted and the texture of Cu-1.0Co-0.65Si-0.1Ti alloy transformed from the {011} <100> Goss texture to the {112} <111> copper texture. The HAGBs and geometrically necessary dislocation (GND) density were calculated, respectively, which can also indicate that the increasing of temperature promoted the dynamic recrystallization. The critical strain for the initiation of dynamic recrystallization in Cu-Co-Si-Ti alloy deformed at 0.01 s(-1) ,800 degrees C and 0.001 s(-1) ,800 degrees C was 0.089 and 0.035, respectively. And it can be inferred that the increasing of deformation temperature or decreasing of strain rate can reduce the critical strain and promote the dynamic recrystallization. Finally, the precipitate was determined to be Co2Si.