The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

被引:5
作者
Cao, Congcong [1 ]
Zhang, Keke [1 ]
Shi, Baojin [2 ]
Wang, Huigai [1 ]
Zhao, Di [1 ]
Sun, Mengmeng [1 ]
Zhang, Chao [1 ]
机构
[1] Henan Univ Sci & Technol, Sch Mat Sci & Engn, Henan Prov Key Lab Nonferrous Met Mat Sci & Proc, Luoyang 471023, Peoples R China
[2] Inst China Shipbldg 725 Ind, Luoyang 471023, Peoples R China
基金
中国国家自然科学基金;
关键词
Sn2; 5Ag0; 7Cu0; 1RExNi lead-free solder; solder joint; thermal-cycle loading; intermetallic compounds; shear strength; LEAD-FREE SOLDER; MECHANICAL-PROPERTIES; INTERMETALLIC COMPOUNDS; SN; NI; GROWTH; AG; BI; EVOLUTION; COMPOUND;
D O I
10.3390/met9050518
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The interface microstructure and shear strength of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal-cycle loading were investigated with scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and physical and chemical tests. The results show that an intermetallic compound (IMC) layer of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints evolved gradually from the scalloped into larger wavy forms with increasing number of thermal cycles. The roughness and average thickness of IMC increased with thermal-cycle loading. However, at longer thermal-cycle loading, the shear strength of the joints was reduced by about 40%. The fracture pathway of solder joints was initiated in the solder seam with ductile fracture mechanism and propagated to the solder seam/IMC layer with ductile-brittle mixed-type fracture mechanism, when the number of thermal cycles increased from 100 to 500 cycles. By adding 0.05 wt.% Ni, the growth of the joint interface IMC could be controlled, and the roughness and average thickness of the interfacial IMC layer reduced. As a result, the shear strength of joints is higher than those without Ni. When compared to joint without Ni, the roughness and average thickness of 0.05 wt.% Ni solder joint interface IMC layer reached the minimum after 500 thermal cycles. The shear strength of that joint was reduced to a minimum of 36.4% of the initial state, to a value of 18.2 MPa.
引用
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页数:13
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