High thermal conductivity epoxies containing substituted biphenyl mesogenic

In this work, a series of high thermal conductivity epoxies containing substituted biphenyl mesogenic were prepared and characterized. The liquid crystalline phase structure of substituted biphenyl epoxies was determined by polarized optical microscopy. Differential scanning calorimetry and thermogravimetric were used to characterize the thermal properties of substituted biphenyl epoxies. The relationship between thermal conductivity and liquid crystalline domain structure was discussed in our paper. The samples show high thermal conductivity up to 0.28 W/(m*K), owing to the introduction of biphenyl mesogenic into epoxes, which indicates that the thermal conductivity was apparently better than that of conventional epoxy systems. The high glass transition temperatures ranging from 128 to 178 degrees C and high thermal resistance can make contribute to a stable fixed shape. The high thermal conductivity and high thermal properties can make this epoxy very suitable for the application in microelectronics.