Effects of Al and N plasma immersion ion implantation on surface microhardness, oxidation resistance and antibacterial characteristics of Cu

被引：7
作者：
An, Quan-zhang [1 ,2 ,3 ]
Feng, Kai [1 ]
Lu, He-ping [1 ]
Cai, Xun [1 ]
Sun, Tie-tun [3 ]
Chu, Paul K. [2 ]
机构：
[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, Shanghai Key Lab Mat Laser Proc & Modificat, Shanghai 200240, Peoples R China
[2] City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong 999077, Hong Kong, Peoples R China
[3] Changzhou EGing Photovolta Technol Co Ltd, Changzhou 213200, Peoples R China
来源：
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA | 2015年 / 25卷 / 06期
关键词：
copper; plasma immersion ion implantation; nanoindentation; oxidation resistance; antibacterial properties; TRIBOLOGICAL PROPERTIES; PHYSICAL-PROPERTIES; COPPER; FILMS; NANOPARTICLES; MICROSTRUCTURE; IMPROVEMENT;
D O I：
10.1016/S1003-6326(15)63802-X
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
Al and N were introduced into copper substrate using plasma immersion ion implantation (PIII) in order to enhance its hardness and oxidation resistance. The dosage of N ion is 5x10(16) cm(-2), and range of dosage of Al ion is 5x10(16)-2x10(17) cm(-2). The oxidation tests indicate that the copper samples after undergoing PIII possess higher oxidation resistance. The degree of oxidation resistance is found to vary with implantation dosage of Al ion. The antibacterial tests also reveal that the plasma implanted copper specimens have excellent antibacterial resistance against Staphylococcus aureus, which are similar to pure copper.
引用
收藏
页码：1944 / 1949
页数：6
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