High-speed hydrophilic and ashing treatments of polyimide using Ar/O2 atmospheric-pressure microwave line plasma

被引:3
作者
Suzuki, H. [1 ,2 ]
Ogasawara, T. [1 ]
Iwata, Y. [1 ]
Bae, H. [1 ]
Toyoda, H. [1 ,2 ,3 ]
机构
[1] Nagoya Univ, Dept Elect, Chikusa Ku, Furo Cho, Nagoya, Aichi 4648603, Japan
[2] Nagoya Univ, Ctr Low Temp Plasma Sci, Chikusa Ku, Furo Cho, Nagoya, Aichi 4648603, Japan
[3] Natl Inst Fus Sci, 322-6 Oroshi Cho, Toki, Gifu 5095292, Japan
关键词
atmospheric-pressure plasma; microwave plasma; surface treatment; wettability control; ashing; VUVAS; ULTRAVIOLET ABSORPTION-SPECTROSCOPY; ABSOLUTE DENSITY-MEASUREMENTS; DIELECTRIC BARRIER DISCHARGE; SURFACE MODIFICATION; GAS TEMPERATURE; GLOW-DISCHARGE; ATOMS; FILMS; JET;
D O I
10.35848/1347-4065/ac64e2
中图分类号
O59 [应用物理学];
学科分类号
摘要
The performance of a newly-developed 1D-long atmospheric-pressure microwave plasma, i.e. atmospheric-pressure microwave line plasma (APMLP), is demonstrated. Using vacuum ultraviolet atomic absorption spectroscopy, spatially uniform oxygen radical density along a 50 cm length is observed. With the APMLP using Ar/O-2 gas, very fast hydrophilic treatment of polyimide (PI) film within 20 ms is obtained. Using looped-waveguide-type APMLP, fast ashing treatment of PI film at an ashing rate of 20 mu m min(-1) is demonstrated.
引用
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页数:5
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