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High-speed hydrophilic and ashing treatments of polyimide using Ar/O2 atmospheric-pressure microwave line plasma
被引:3
作者:
Suzuki, H.
[1
,2
]
Ogasawara, T.
[1
]
Iwata, Y.
[1
]
Bae, H.
[1
]
Toyoda, H.
[1
,2
,3
]
机构:
[1] Nagoya Univ, Dept Elect, Chikusa Ku, Furo Cho, Nagoya, Aichi 4648603, Japan
[2] Nagoya Univ, Ctr Low Temp Plasma Sci, Chikusa Ku, Furo Cho, Nagoya, Aichi 4648603, Japan
[3] Natl Inst Fus Sci, 322-6 Oroshi Cho, Toki, Gifu 5095292, Japan
关键词:
atmospheric-pressure plasma;
microwave plasma;
surface treatment;
wettability control;
ashing;
VUVAS;
ULTRAVIOLET ABSORPTION-SPECTROSCOPY;
ABSOLUTE DENSITY-MEASUREMENTS;
DIELECTRIC BARRIER DISCHARGE;
SURFACE MODIFICATION;
GAS TEMPERATURE;
GLOW-DISCHARGE;
ATOMS;
FILMS;
JET;
D O I:
10.35848/1347-4065/ac64e2
中图分类号:
O59 [应用物理学];
学科分类号:
摘要:
The performance of a newly-developed 1D-long atmospheric-pressure microwave plasma, i.e. atmospheric-pressure microwave line plasma (APMLP), is demonstrated. Using vacuum ultraviolet atomic absorption spectroscopy, spatially uniform oxygen radical density along a 50 cm length is observed. With the APMLP using Ar/O-2 gas, very fast hydrophilic treatment of polyimide (PI) film within 20 ms is obtained. Using looped-waveguide-type APMLP, fast ashing treatment of PI film at an ashing rate of 20 mu m min(-1) is demonstrated.
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页数:5
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