Joining of 70 Vol. % SiCp/Al Composites by Self-Propagating Reaction Using the Al/Ni Nano-Multilayer Films

70 vol.% SiCp/Al composites were joined by self-propagating exothermic reaction initiated by Al/Ni nano-multilayer films. The effects of heat release and bonding pressure on the microstructure and mechanical properties of joints were studied. The results show that the joint is composed of base metal, solder layer and the product of Al/Ni nano-multilayer films, there is no obvious element diffusion at the joint. When the thickness of the film increases, the heat release increases. When the thickness of the film is 180 mu m, the solder melts fully, the wettability and fluidity are increased and there are no obvious defects and harmful reactants at the interface. The strength of the joint increases at first and then decreases with the increase in the bonding pressure. When the thickness of the film is 180 mu m and bonding pressure is 120 MPa, the maximum shear strength 32.8 MPa of the joint is obtained. [GRAPHICS] .