Preparation of a low temperature sintering silver nanoparticle ink and fabrication of conductive patterns on PET substrate

被引：0
|
作者：
Huang, Hai-Jun
Zhou, Min-Bo
Yin, Can
Chen, Qi-Wang
Zhang, Xin-Ping [1 ]
机构：
[1] South China Univ Technol, Lab Smart Mat & Elect Packaging, Sch Mat Sci & Engn, Guangzhou 510640, Guangdong, Peoples R China
来源：
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2018年
基金：
中国国家自然科学基金;
关键词：
silver nanoparticle; conductive ink; flexible electronics; low temperature sintering; ROOM-TEMPERATURE; PRINTED ELECTRONICS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A low temperature sinterable conductive ink was prepared using silver nanoparticles (Ag NPs) as filler material. The polydisperse Ag NPs with diameters of 5-85 nm were synthesized using polyacrylic acid (PAA) as stabilizer. The sintering temperature of the Ag NPs can be lowered from conventionally used 200 degrees C to 80 degrees C in the presence of chloride. The silver ink with metal loading of 47 wt.% was successfully printed on poly ethylene terephthalate (PET) substrate through screen printing technique. The resistivity of the silver film is 1.52 x 10(-7) Omega.m after sintering at 120 degrees C for 1 h. Finally, highly conductive patterns on PET substrate for flexible electronics application were fabricated.
引用
收藏
页码：482 / 485
页数：4
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