Low material budget microfabricated cooling devices for particle detectors and front-end electronics

被引：14

作者：

Mapelli, A. ^{[1
,2
]}

Catinaccio, A. ^{[1
]}

Daguin, J. ^{[1
]}

van Lintel, H. ^{[2
]}

Nuessle, G. ^{[3
]}

Petagna, P. ^{[1
]}

Renaud, P. ^{[2
]}

机构：

[1] CERN, Dept Phys, Geneva, Switzerland

[2] Ecole Polytech Fed Lausanne, Lab Microsyst, CH-1015 Lausanne, Switzerland

[3] Catholic Univ Louvain, CP3, B-1348 Louvain, Belgium

来源：

NUCLEAR PHYSICS B-PROCEEDINGS SUPPLEMENTS | 2011年 / 215卷

关键词：

D O I：

10.1016/j.nuclphysbps.2011.04.050

中图分类号：

O412 [相对论、场论]; O572.2 [粒子物理学];

学科分类号：

摘要：

Novel cooling systems with very low material budget are being fabricated and studied. They consist of silicon wafers in which microchannels are etched and closed by bonding another wafer. This cooling option is being considered for future HEP detectors of the sLHC and linear colliders. It is currently under investigation as an option for the cooling of the NA62 Gigatracker silicon pixel detector and its front-end electronics where the rnicrofabricated cooling plate would stand directly in the beam. In this particular case, microchannel cooling meets both the very aggressive X(0) (0.15%) specifications and the anticipated 2 W/cm(2) power dissipation by the active electronics.

引用

页码：349 / 352

页数：4

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