Characteristics of Cu(In,Ga)Se2 Films Prepared by Atmospheric Pressure Selenization of Cu-In-Ga Precursors Using Ditert-Butylselenide as Se Source

被引:12
|
作者
Hsiao, Sheng-Yu [1 ]
Yang, Pei-Ching [1 ]
Ni, Ho-Ching [1 ]
Yen, Kuo-Yi [1 ]
Chiu, Chien-Hua [1 ]
Lin, Pei-Shin [1 ]
Chen, Hung-Jung [1 ]
Wu, Cheng-Han [2 ]
Liang, Shih-Chang [2 ]
Ni, Guo-Yu [2 ]
Jih, Far-Wen [2 ]
Chiang, Cheng-Der [2 ]
Gong, Jyh-Rong [1 ]
机构
[1] Natl Chung Hsing Univ, Dept Phys, Taichung 402, Taiwan
[2] Chung Shan Inst Sci & Technol, Mat & Electroopt Res Div, Tao Yuan 325, Taiwan
关键词
CHEMICAL-VAPOR-DEPOSITION; THIN-FILMS; SOLAR-CELLS; DIFFUSION;
D O I
10.1149/2.021204jes
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
In this study, copper indium gallium diselenide [Cu(In,Ga)Se-2; CIGS] films were prepared by selenization of Cu-In-Ga metallic precursors using ditert-butylselenide (DTBSe) under atmospheric pressure. Based on the results of theta-to-2 theta X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM) and transmission electron microscopy (TEM), it was found that the films selenized at 300 or 400 degrees C for 60 min showed the presence of Kirkendall voids along with the XRD signitures of pure copper (Cu) and certain intermediate binary selenides, copper indium diselenide (CIS) and CIGS depending on temperature while only a single CIGS structure was detected in those films selenized at 500 or 600 degrees C for 60 min. A 5-temperature selenization process was found to enable the formation of CIGS structure with better crystalline quality and thickness uniformity. It is believed that intermediate binary and ternary selenides are formed sequentially with increasing completeness during low-temperature selenization stages of the 5-temperature selenization process. This enhances the subsequent formation of CIGS structure at high-temperature selenization stages of the 5-temperature selenization process with improved structural and morphological properties. (C) 2012 The Electrochemical Society. [DOI: 10.1149/2.021204jes] All rights reserved.
引用
收藏
页码:H378 / H383
页数:6
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