50-nm fully depleted SOICMOS technology with HfO2 gate dielectric and TiN gate

被引:13
|
作者
Vandooren, A [1 ]
Egley, S [1 ]
Zavala, M [1 ]
Stephens, T [1 ]
Mathew, L [1 ]
Rossow, M [1 ]
Thean, A [1 ]
Barr, A [1 ]
Shi, Z [1 ]
White, T [1 ]
Pham, D [1 ]
Conner, J [1 ]
Prabhu, L [1 ]
Triyoso, D [1 ]
Schaeffer, J [1 ]
Roan, D [1 ]
Nguyen, BY [1 ]
Orlowski, M [1 ]
Mogab, J [1 ]
机构
[1] Motorola Inc, Adv Prod Res & Dev Lab, Austin, TX 78721 USA
关键词
fully depleted SOI; high-k dielectric; metal gate; raised SD extension;
D O I
10.1109/TNANO.2003.820502
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we demonstrate for the first time CMOS thin-film metal gate FDSOI devices,using HfO2 gate dielectric at the 50-nm physical gate length. Symmetric V-T is achieved for long-channel nMOS and pMOS devices using midgap TiN single metal gate with undoped channel and high-k dielectric. The devices show excellent performance with a I-on = 500 muA/mum and I-off = 10 nA/mum at V-DD = 1.2 V for nMOSFET and I-on = 212 muA/mum and I-off = 44 pA/mum at V-DD = -1.2 V for pMOSFET, with a CET = 30 Angstrom and a gate length of 50 nm. DIBL and SS values as low as 70 mV/V nand 77 mV/dec, respectively, are obtained with a silicon film thickness of 14 nm. Ring oscillators with 15 ps stage delay at V-DD = 1.2 V are also realized.
引用
收藏
页码:324 / 328
页数:5
相关论文
共 50 条
  • [1] Organic Mask Removal Assessment For 32nm Fully Depleted SOI Technology With TiN-Metal Gate On HfO2
    Lachal, L.
    Chiaroni, J.
    Lajoinie, E.
    Louveau, O.
    Ritton, F.
    Lavios, P.
    Finet, J. M.
    Brianceau, P.
    Arnoux, A.
    Sauvagnargues, E.
    Billoux, O.
    Medico, G.
    Tallaron, C.
    Humbert, F.
    Rochat, N.
    Martinez, E.
    PHYSICS AND TECHNOLOGY OF HIGH-K GATE DIELECTRICS 6, 2008, 16 (05): : 355 - +
  • [2] Fully-depleted SOICMOS devices with W/TiN gate
    Lian, J
    Hai, CH
    2004: 7TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUITS TECHNOLOGY, VOLS 1- 3, PROCEEDINGS, 2004, : 273 - 276
  • [3] Impact of gate process technology on EOT of HfO2 gate dielectric
    Ha, D
    Lu, Q
    Takeuchi, H
    King, TJ
    Onishi, K
    Kim, YH
    Lee, JC
    COMOS FRONT-END MATERIALS AND PROCESS TECHNOLOGY, 2003, 765 : 41 - 45
  • [4] Fully-depleted SOI devices with TaSiN gate, HfO2 gate dielectric, and elevated source/drain extensions
    Vandooren, A
    Barr, A
    Mathew, L
    White, TR
    Egley, S
    Pham, D
    Zavala, M
    Samavedam, S
    Schaeffer, J
    Conner, J
    Nguyen, BY
    White, BE
    Orlowski, MK
    Mogab, J
    IEEE ELECTRON DEVICE LETTERS, 2003, 24 (05) : 342 - 344
  • [5] Metal gate MOSFETs with HfO2 gate dielectric
    Samavedam, SB
    Tseng, HH
    Tobin, PJ
    Mogab, J
    Dakshina-Murthy, S
    La, LB
    Smith, J
    Schaeffer, J
    Zavala, M
    Martin, R
    Nguyen, BY
    Hebert, L
    Adetutu, O
    Dhandapani, V
    Luo, TY
    Garcia, R
    Abramowitz, P
    Moosa, M
    Gilmer, DC
    Hobbs, C
    Taylor, WJ
    Grant, JM
    Hedge, R
    Bagchi, S
    Luckowski, E
    Arunachalam, V
    Azrak, M
    2002 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2002, : 24 - 25
  • [6] Co-integrated dual strained channels on fully depleted sSDOI CMOSFETs with HfO2/TiN gate stack down to 15nm gate length
    Andrieu, F
    Ernst, T
    Faynot, O
    Bogumilowicz, Y
    Hartmann, JM
    Eymery, J
    Lafond, D
    Levaillant, YM
    Dupré, C
    Powers, R
    Fournel, F
    Fenouillet-Beranger, C
    Vandooren, A
    Ghyselen, B
    Mazure, C
    Kernevez, N
    Ghibaudo, G
    Deleonibus, S
    2005 IEEE INTERNATIONAL SOI CONFERENCE, PROCEEDINGS, 2005, : 223 - 225
  • [7] Performance and reliability of sub-100nm TaSiN metal gate fully-depleted SOI devices with high-K (HfO2) gate dielectric
    Thean, AVY
    Vandooren, A
    Kalpat, S
    Du, Y
    To, I
    Hughes, J
    Stephens, T
    Goolsby, B
    White, T
    Barr, A
    Mathew, L
    Huang, M
    Egley, S
    Zavala, M
    Eades, D
    Sphabmixay, K
    Schaeffer, J
    Triyoso, D
    Rossow, M
    Roan, D
    Pham, D
    Rai, R
    Murphy, S
    Nguyen, BY
    White, BE
    Duvallet, A
    Dao, T
    Mogab, J
    2004 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2004, : 106 - 107
  • [8] HfO2 gate dielectric with 0.5 nm equivalent oxide thickness
    Harris, H
    Choi, K
    Mehta, N
    Chandolu, A
    Biswas, N
    Kipshidze, G
    Nikishin, S
    Gangopadhyay, S
    Temkin, H
    APPLIED PHYSICS LETTERS, 2002, 81 (06) : 1065 - 1067
  • [9] In-depth electrical characterization of sub-45 nm fully depleted strained SOI MOSFETs with TiN/HfO2 gate stack
    Feruglio, S.
    Andrieu, F.
    Faynot, O.
    Ghibaudo, G.
    SOLID-STATE ELECTRONICS, 2008, 52 (04) : 489 - 497
  • [10] 55nm high mobility SiGe(:C) pMOSFETs with HfO2 gate dielectric and TiN metal gate for advanced CMOS
    Weber, O
    Ducroquet, F
    Ernst, T
    Andrieu, F
    Damlencourt, JF
    Hartmann, JM
    Guillaumot, B
    Papon, AM
    Dansas, H
    Brévard, L
    Toffoli, A
    Besson, P
    Martin, F
    Morand, Y
    Deleonibus, S
    2004 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2004, : 42 - 43