3D large deformation and nonlinear stress analyses of tin whisker initiation and growth on lead-free components

被引：7

作者：

Lau, JH ^{[1
]}

Pan, SH ^{[1
]}

Xu, C ^{[1
]}

机构：

[1] Agilent Technol, Santa Clara, CA 95052 USA

来源：

53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS | 2003年

关键词：

D O I：

10.1109/ECTC.2003.1216358

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

In this study, a 3D nonlinear stress and large deflection analysis of the tin whisker initiation and growth on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to compressive stress acting at the Sn-layer, which is generated by the spontaneous chemical reaction of the diffusion of Cu into Sn and the formation of Cu6Sn5. The Sn-layer is assumed to be an elasto-perfectly-plastic material. The results presented herein is useful in understanding why the compressive stress in the Sn-layer can initiate and grow a tin whisker at the weak spot of a SnOx-layer. Also, a set of useful methods is suggested to reduce (or even prevent) the reliability risk of Sn whiskers.

引用

页码：692 / 697

页数：6

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