Ni-Mo alloys with a high molybdenum content using pulse-plating method

被引：1
|
作者：
Rengakuji, S [1 ]
Takano, T
Nakamura, Y
Ikeno, S
Shimasaki, C
机构：
[1] Toyama Univ, Fac Engn, Dept Syst Engn Mat & Life Sci, Gofu Ku, Toyama 9308555, Japan
[2] NACHI Fujikoshi Corp, Toyama 9308511, Japan
来源：
DENKI KAGAKU | 1998年 / 66卷 / 07期
关键词：
electroplating; Ni-Mo alloys;
D O I：
10.5796/kogyobutsurikagaku.66.754
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
[No abstract available]
引用
收藏
页码：754 / 756
页数：3
相关论文
共 50 条
  • [1] Pulse plating of Ni-Mo alloys from Ni-rich electrolytes
    Marlot, A
    Kern, P
    Landolt, D
    ELECTROCHIMICA ACTA, 2002, 48 (01) : 29 - 36
  • [2] PULSE PLATING OF NI-MO ALLOY COATINGS
    CHERKAOUI, M
    CHASSAING, E
    QUANG, KV
    PLATING AND SURFACE FINISHING, 1986, 73 (08): : 38 - 38
  • [3] Pulse-plating of copper-cobalt alloys
    Bradley, PE
    Landolt, D
    ELECTROCHIMICA ACTA, 1999, 45 (07) : 1077 - 1087
  • [4] ELECTRODEPOSITION OF HIGH MO CONTENT NI-MO ALLOYS UNDER FORCED-CONVECTION
    PODLAHA, EJ
    MATLOSZ, M
    LANDOLT, D
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1993, 140 (10) : L149 - L151
  • [5] ELECTRODEPOSITION OF NI-MO ALLOYS WITH PULSE REVERSE POTENTIALS
    CHASSAING, E
    ROUMEGAS, MP
    TRICHET, MF
    JOURNAL OF APPLIED ELECTROCHEMISTRY, 1995, 25 (07) : 667 - 670
  • [6] Computer-controlled pulse-plating of alloys
    Kazeminezhad, I
    Schwarzacher, W
    ELECTROCHEMICAL TECHNOLOGY APPLICATIONS IN ELECTRONICS III, 2000, 99 (34): : 250 - 254
  • [7] Effect of pulse plating parameters on the structure and properties of electrodeposited Ni-Mo films
    Allahyarzadeh, M. H.
    Ashrafi, A.
    Golgoon, A.
    Roozbehani, B.
    MATERIALS CHEMISTRY AND PHYSICS, 2016, 175 : 215 - 222
  • [8] Pulse-Plating of Copper-Silver Alloys for Interconnect Applications
    Volov, Igor
    Swanson, Edward
    O'Brien, Brendan
    Novak, Steven W.
    van den Boom, Ruud
    Dunn, Kathleen
    West, Alan C.
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2012, 159 (11) : D677 - D683
  • [9] Electrodeposition of High Mo Content Amorphous/Nanocrystalline Ni-Mo Using Ionic Liquids as Additive
    Allahyarzadeh, M. H.
    Roozbehani, B.
    Ashrafi, A.
    Shadizadeh, S. R.
    Kheradmand, E.
    ELECTRODEPOSITION OF NANOENGINEERED MATERIALS AND DEVICES 4, 2012, 41 (44): : 11 - 28
  • [10] Pulse-plating of copper-nickel alloys from a sulfamate solution
    Bradley, P
    Roy, S
    Landolt, D
    JOURNAL OF THE CHEMICAL SOCIETY-FARADAY TRANSACTIONS, 1996, 92 (20): : 4015 - 4019
12345