Compression and Fungal Heat Production in Maize Bulk Considering Kernel Breakage

被引:6
|
作者
Liu, Chaosai [1 ]
Zhou, Yang [1 ,2 ,3 ]
Chen, Guixiang [1 ,2 ,3 ]
Zheng, Deqian [1 ,2 ,3 ]
Yue, Longfei [1 ]
机构
[1] Henan Univ Technol, Coll Civil Engn, Zhengzhou 450001, Peoples R China
[2] Henan Key Lab Grain Storage Facil & Safety, Zhengzhou 450001, Peoples R China
[3] Henan Int Joint Lab Modern Green Ecol Storage Sys, Zhengzhou 450001, Peoples R China
来源
APPLIED SCIENCES-BASEL | 2022年 / 12卷 / 10期
关键词
maize bulk; kernel breakage; vertical pressure; deformation; heat production; THERMAL-CONDUCTIVITY; PRESSURE; CORN; SIMULATION; FRACTIONS; DENSITY; WHEAT;
D O I
10.3390/app12104870
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Breakage in maize kernels and vertical pressure in grains lead to the uneven distribution of grain bulk density, which easily causes undesired problems in terms of grain storage. The objective of this study was, therefore, to determine the compression and heat production of the whole kernel (WK) and half kernel (HK) under two different loadings, i.e., 50 and 150 kPa, in maize bulk. An easy-to-use element testing system was developed by modification of an oedometer, and an empirical-analytical-numerical method was established to evaluate fungal heat production, considering kernel breakage and vertical pressure. Based on the experimental results, it was found that breakage induced larger compression; the compression of HK was 62% and 58% higher than that of WK at 50 kPa and 150 kPa, respectively. The creep model of the Hooke spring-Kelvin model in series can be used to accurately describe the creep behavior of maize bulk. Fungi and aerobic plate counting (APC) were affected significantly by the breakage and vertical pressure. APC in HK was 19 and 15 times that of WK under 150 and 50 kPa, respectively. The heat released by the development of fungi was found to be directly related to the APC results. The average temperatures of WK and HK under 150 and 50 kPa were 11.1%, 9.7%, 7.9%, and 7.6% higher than the room temperature, respectively. A numerical method was established to simulate the temperature increase due to fungi development. Based on the numerical results, heat production (Q) by fungi was estimated, and the results showed that the Q in HK was 1.29 and 1.32 times that of WK on average under 150 and 50 kPa. Additionally, the heat production results agreed very well with the APC results.
引用
收藏
页数:13
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