Dry sliding behavior of copper based composite materials prepared using conventional compaction and sintering technique and spark plasma sintering

The study aimed to investigate the dry sliding properties of as received copper based composite materials, with varying silica and copper content, and produced through two different techniques: conventional compaction and sintering and spark plasma sintering (SPS). The SPS process induced pronounced densification and hardness of the materials and a better distribution of constituents when compared to conventionally sintered specimens. The SPS specimens observed the presence of a C layer of varying thickness on their surfaces, transferred from the graphite die used for their production. The thickness and adhesion of the C layer was influenced by the silica content in the specimens. Specimens containing low silica content showed a significant C layer on the pin surface. This C layer was not removed during dry sliding pin on disc testing, thus resulting in very low COF (coefficient of friction) and pin wear. Specimens containing high silica content led to the formation of a sparse C layer on their surfaces due to the low chemical interactions of silica with other atoms or compounds, leading to easy removal during tests and elevated COF magnitude. However, high silica content also led to low adhesion between the friction layer and the worn surfaces, resulting in instability and higher pin wear. The specimens containing moderate silica content were identified as the best composition due to their ability to easily shed the C layer during testing, maintain smooth, compact, and continuous friction layer without any detachment/adherence issues, and demonstrate permissible COF and pin wear in the mild range.