The microstructure and properties of a new type of Cu-Fe-P alloy

被引：0

作者：

Cao Xingmin ^{[1
]}

Xiang Chaojian ^{[1
]}

Yang Chunxiu ^{[1
]}

Mu Siguo ^{[1
]}

Guo Fuan ^{[1
]}

机构：

[1] Suzhou Inst Nonferrous Metal Res, Suzhou 215021, Peoples R China

来源：

RARE METAL MATERIALS AND ENGINEERING | 2007年 / 36卷

关键词：

IC frame; copper alloy; deformation;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A new type of Cu-Fe-P alloy used for IC frame was designed. The effect of prior cold work and aging on mechanical properties and electrical conductivity of the alloy were investigated. The rule of transformation of microstructure by processing and heat treatment were analysed by measuring stress-strain curves, hardness and electrical conductivity. The mechanism of the change of microstructure and properties were discussed.

引用

页码：527 / 529

页数：3

共 6 条

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