Toughened, inorganic-organic hybrid materials for microelectronic application

Transparent, nanophase-separated, inorganic-organic hybrid polymers with dielectric constants below 3.0 have been prepared from reactively functionalized poly(amic eater) derivatives and substituted, oligomeric silsesquioxanes. These hybrid materials are stable to 400 degrees C and above and form tough, crack-free films. Induced cracking and crack propagation studies performed with the application of external stress suggest a maximum critical film thickness of at least 2.0 mu m under severe stress conditions. These hybrid materials appear to be significantly toughened by the chemical incorporation of the polyimides relative to organically modified silicates and spin-on-glasses without significantly effecting other important polymer properties of the silicates.