Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison

被引：186

作者：

Ali, Hafiz Muhammad ^{[1
]}

Arshad, Adeel ^{[2
]}

Jabbal, Mark ^{[2
]}

Verdin, P. G. ^{[3
]}

机构：

[1] Univ Engn & Technol, Dept Mech Engn, Taxila, Pakistan

[2] Univ Nottingham, Fac Engn, Fluids & Thermal Engn FLUTE Res Grp, Nottingham NG7 2RD, England

[3] Cranfield Univ, Energy & Power Theme, Cranfield MK43 0AL, Beds, England

来源：

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | 2018年 / 117卷

关键词：

Phase change materials (PCMs); Thermal conductivity enhancers (TCEs); Pin-fin heat sinks; Paraffin wax; n-Eicosane; Set point temperatures (SPTs); PHASE-CHANGE MATERIALS; PERFORMANCE; OPTIMIZATION;

D O I：

10.1016/j.ijheatmasstransfer.2017.10.065

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

The present paper covers the comparison of two different configurations (square and circular)pin-fin heat sinks embedded with two different phase change materials (PCMs) namely paraffin wax and n-eicosane having different thermo-physical properties were carried out for passive cooling of electronic devices. The pin-fins, acting as thermal conductivity enhancers (TCEs), of 2 mm square and 3 mm circular fin thickness of constant volume fraction of 9% are chosen and input heat fluxes from 1.2 kW/m(2) to 3.2 kW/m(2) with an increment of 0.4 kW/m(2) are provided. Two different critical set point temperatures (SPTs) 45 degrees C and 65 degrees C are chosen to explore the thermal performance in terms of enhancement ratios, enhancement in operation time, latent heating phase duration, thermal capacity and conductance. The results show that 3 mm diameter of circular pin-fins has the best thermal performance in passive thermal management of electronic devices. (C) 2017 Elsevier Ltd. All rights reserved.

引用

页码：1199 / 1204

页数：6

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