Superconformal electrodeposition of silver from a KAg(CN2)-KCN-KSeCN electrolyte

被引：50
作者：
Baker, BC [1 ]
Freeman, M
Melnick, B
Wheeler, D
Josell, D
Moffat, TP
机构：
[1] Natl Inst Stand & Technol, Gaithersburg, MD 20899 USA
[2] Motorola Inc, Adv Prod Res & Dev Lab, Austin, TX 78721 USA
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2003年 / 150卷 / 02期
关键词：
D O I：
10.1149/1.1531195
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Electrodeposition of silver from a KAg(CN)(2)-KCN electrolyte was investigated. The addition of potassium selenocyanate (KSeCN) results in a hysteretic current-voltage response, specular films, and superconformal growth in submicrometer vias. These observations are well described by the recently proposed curvature enhanced accelerator coverage model of film growth. (C) 2002 The Electrochemical Society.
引用
收藏
页码：C61 / C66
页数：6
相关论文
共 10 条
[1]   Self-encapsulation effects on the electromigration resistance of silver lines [J].
Alford, TL ;
Zeng, YX ;
Nguyen, P ;
Chen, LH ;
Mayer, JW .
MICROELECTRONIC ENGINEERING, 2001, 55 (1-4) :389-395
[2]   Electromigration resistance of sputtered silver lines using different patterning techniques [J].
Hauder, M ;
Hansch, W ;
Gstöttner, J ;
Schmitt-Landsiedel, D .
MICROELECTRONIC ENGINEERING, 2002, 60 (1-2) :51-57
[3]   Superconformal deposition by surfactant-catalyzed chemical vapor deposition [J].
Josell, D ;
Wheeler, D ;
Moffat, TP .
ELECTROCHEMICAL AND SOLID STATE LETTERS, 2002, 5 (03) :C44-C47
[4]   Via filling by electrodeposition - Superconformal silver and copper and conformal nickel [J].
Josell, D ;
Baker, B ;
Witt, C ;
Wheeler, D ;
Moffat, TP .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2002, 149 (12) :C637-C641
[5]   Superconformal electrodeposition in submicron features [J].
Josell, D ;
Wheeler, D ;
Huber, WH ;
Moffat, TP .
PHYSICAL REVIEW LETTERS, 2001, 87 (01) :1-016102
[6]   A simple equation for predicting superconformal electrodeposition in submicrometer trenches [J].
Josell, D ;
Wheeler, D ;
Huber, WH ;
Bonevich, JE ;
Moffat, TP .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2001, 148 (12) :C767-C773
[7]   Silver metallization for advanced interconnects [J].
Manepalli, R ;
Stepaniak, F ;
Bidstrup-Allen, SA ;
Kohl, PA .
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 1999, 22 (01) :4-8
[8]   Superconformal electrodeposition of silver in submicrometer features [J].
Moffat, TP ;
Baker, B ;
Wheeler, D ;
Bonevich, JE ;
Edelstein, M ;
Kelly, DR ;
Gan, L ;
Stafford, GR ;
Chen, PJ ;
Egelhoff, WF ;
Josell, D .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2002, 149 (08) :C423-C428
[9]   Superconformal electrodeposition of copper [J].
Moffat, TP ;
Wheeler, D ;
Huber, WH ;
Josell, D .
ELECTROCHEMICAL AND SOLID STATE LETTERS, 2001, 4 (04) :C26-C29
[10]  
OTA M, 2002, P SPRING M MAT RES S
1