Interface fracture properties of thin films studied by using the micro-cantilever deflection technique

被引：75

作者：

Matoy, Kurt ^{[1
,2
,3
]}

Detzel, Thomas ^{[4
]}

Mueller, Matthias ^{[4
]}

Motz, Christian ^{[2
]}

Dehm, Gerhard ^{[2
,3
]}

机构：

[1] Kompetenzzentrum Automobil & Ind Elekt GmbH, A-9524 Villach, Austria

[2] Austrian Acad Sci, Erich Schmid Inst Mat Sci, A-8700 Leoben, Austria

[3] Univ Leoben, Dept Mat Phys, A-8700 Leoben, Austria

[4] Infineon Technol Austria AG, A-9500 Villach, Austria

来源：

SURFACE & COATINGS TECHNOLOGY | 2009年 / 204卷 / 6-7期

关键词：

Interface toughness; Micro-cantilever; Ion beam processing; COATINGS; ADHESION;

D O I：

10.1016/j.surfcoat.2009.09.013

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The mechanical behavior of interfaces between silicon oxide and metallic thin films is investigated using an alternative approach which is based on the miniaturized cantilever deflection technique (Weihs et al., 1988 [1]). The critical energy release rates for three different silicon oxide/metal systems are determined and the results are discussed in this paper. The technique suggested may be applicable with high spatial resolution for a wide variety of structured thin film systems. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：878 / 881

页数：4

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