Resistive Random Access Memory (RRAM): an Overview of Materials, Switching Mechanism, Performance, Multilevel Cell (mlc) Storage, Modeling, and Applications

被引:652
作者
Zahoor, Furqan [1 ]
Azni Zulkifli, Tun Zainal [1 ]
Khanday, Farooq Ahmad [2 ]
机构
[1] Univ Teknol Petronas, Dept Elect & Elect Engn, Seri Iskandar 32610, Perak, Malaysia
[2] Univ Kashmir, PG Dept Elect & Instrumentat Technol, Srinagar 190005, Jammu & Kashmir, India
来源
NANOSCALE RESEARCH LETTERS | 2020年 / 15卷 / 01期
关键词
Emerging memory; Multilevel cell (MLC); Non-volatile storage; Oxygen vacancies; Resistive random access memory (RRAM); Resistance switching; THERMAL DISSOLUTION MODEL; DRIVEN ION MIGRATION; LOW-POWER; TANTALUM OXIDE; RESET STATISTICS; AL2O3-BASED RRAM; SYNAPTIC DEVICE; COMPACT MODEL; BIPOLAR; VOLTAGE;
D O I
10.1186/s11671-020-03299-9
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this manuscript, recent progress in the area of resistive random access memory (RRAM) technology which is considered one of the most standout emerging memory technologies owing to its high speed, low cost, enhanced storage density, potential applications in various fields, and excellent scalability is comprehensively reviewed. First, a brief overview of the field of emerging memory technologies is provided. The material properties, resistance switching mechanism, and electrical characteristics of RRAM are discussed. Also, various issues such as endurance, retention, uniformity, and the effect of operating temperature and random telegraph noise (RTN) are elaborated. A discussion on multilevel cell (MLC) storage capability of RRAM, which is attractive for achieving increased storage density and low cost is presented. Different operation schemes to achieve reliable MLC operation along with their physical mechanisms have been provided. In addition, an elaborate description of switching methodologies and current voltage relationships for various popular RRAM models is covered in this work. The prospective applications of RRAM to various fields such as security, neuromorphic computing, and non-volatile logic systems are addressed briefly. The present review article concludes with the discussion on the challenges and future prospects of the RRAM.
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页数:26
相关论文
共 183 条
[31]   Highly stable ITO/Zn2TiO4/Pt resistive random access memory and its application in two-bit-per-cell [J].
Chen, Shi-Xiang ;
Chang, Sheng-Po ;
Hsieh, Wei-Kang ;
Chang, Shoou-Jinn ;
Lin, Chih-Chien .
RSC ADVANCES, 2018, 8 (32) :17622-17628
[32]   Switching characteristics of W/Zr/HfO2/TiN ReRAM devices for multi-level cell non-volatile memory applications [J].
Chen, Wenbo ;
Lu, Wenchao ;
Long, Branden ;
Li, Yibo ;
Gilmer, David ;
Bersuker, Gennadi ;
Bhunia, Swarup ;
Jha, Rashmi .
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2015, 30 (07)
[33]  
Chen Y, 2009, IEEE RADIO WIRELESS, P99
[34]   Dynamic conductance characteristics in HfOx-based resistive random access memory [J].
Chen, Ying-Chen ;
Chang, Yao-Feng ;
Wu, Xiaohan ;
Zhou, Fei ;
Guo, Meiqi ;
Lin, Chih-Yang ;
Hsieh, Cheng-Chih ;
Fowler, Burt ;
Chang, Ting-Chang ;
Lee, Jack C. .
RSC ADVANCES, 2017, 7 (21) :12984-12989
[35]  
Chen Z, 2015, 2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)
[36]   Ultrafast Multilevel Switching in Au/YIG/n-Si RRAM [J].
Chen, Zhiwei ;
Huang, Weichuan ;
Zhao, Wenbo ;
Hou, Chuangming ;
Ma, Chao ;
Liu, Chuanchuan ;
Sun, Haoyang ;
Yin, Yuewei ;
Li, Xiaoguang .
ADVANCED ELECTRONIC MATERIALS, 2019, 5 (02)
[37]   Conduction mechanism of resistive switching films in MgO memory devices [J].
Chiu, Fu-Chien ;
Shih, Wen-Chieh ;
Feng, Jun-Jea .
JOURNAL OF APPLIED PHYSICS, 2012, 111 (09)
[38]   Reliability characteristics and conduction mechanisms in resistive switching memory devices using ZnO thin films [J].
Chiu, Fu-Chien ;
Li, Peng-Wei ;
Chang, Wen-Yuan .
NANOSCALE RESEARCH LETTERS, 2012, 7 :1-9
[39]   Low Store Energy, Low VDDmin, 8T2R Nonvolatile Latch and SRAM With Vertical-Stacked Resistive Memory (Memristor) Devices for Low Power Mobile Applications [J].
Chiu, Pi-Feng ;
Chang, Meng-Fan ;
Wu, Che-Wei ;
Chuang, Ching-Hao ;
Sheu, Shyh-Shyuan ;
Chen, Yu-Sheng ;
Tsai, Ming-Jinn .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2012, 47 (06) :1483-1496
[40]   Joint contributions of Ag ions and oxygen vacancies to conducting filament evolution of Ag/TaOx/Pt memory device [J].
Chung, Yu-Lung ;
Cheng, Wen-Hui ;
Jeng, Jiann-Shing ;
Chen, Wei-Chih ;
Jhan, Sheng-An ;
Chen, Jen-Sue .
JOURNAL OF APPLIED PHYSICS, 2014, 116 (16)