CMOS-Compatible encapsulated silver bandpass filters

被引：0

作者：

Rais-Zadeh, Mina ^{[1
]}

Lavasani, Hossein M. ^{[1
]}

Ayazi, Farrokh ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30308 USA

来源：

2007 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-6 | 2007年

关键词：

bandpass filters; elliptic filters; micromachining; packaging; Q factor; silver;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents the design, implementation, and characterization of low insertion loss (IL) encapsulated silver bandpass filters for radio frequency integrated circuits. The effect of the metal and the substrate loss on the performance of the filter is investigated. A polymer-encapsulated third-order elliptic filter shows an embedded insertion loss of 1.9 dB at 1.2 GHz with a bandwidth of 300 MHz.

引用

页码：1297 / 1300

页数：4

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