Shear-induced softening of nanocrystalline metal interfaces at cryogenic temperatures

被引：25

作者：

Chandross, Michael ^{[1
]}

Curry, John F. ^{[1
]}

Babuska, Tomas F. ^{[1
]}

Lu, Ping ^{[1
]}

Furnish, Timothy A. ^{[1
]}

Kustas, Andrew B. ^{[1
]}

Nation, Brendan L. ^{[1
]}

Staats, Wayne L. ^{[2
]}

Argibay, Nicolas ^{[1
]}

机构：

[1] Sandia Natl Labs, Mat Phys & Chem Sci Ctr, Albuquerque, NM 87123 USA

[2] Sandia Natl Labs, Energy & Transportat Technol Ctr, Livermore, CA 94550 USA

来源：

SCRIPTA MATERIALIA | 2018年 / 143卷

关键词：

Grain boundary sliding; Cryogenic; Friction; Copper; Inverse Hall-Petch; MAXIMUM STRENGTH; CLEAN METALS; NI-W; EVOLUTION; FRICTION; CONTACT; STRESS; WEAR; NUCLEATION; BREAKDOWN;

D O I：

10.1016/j.scriptamat.2017.09.006

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

We demonstrate inverse Hall-Petch behavior (softening) in pure copper sliding contacts at cryogenic temperatures. By kinetically limiting grain growth, it is possible to generate a quasi-stable ultra-nanocrystalline surface layer with reduced strength. In situ electrical contact resistance measurements were used to determine grain size evolution at the interface, in agreement with reports of softening in highly nanotwinned copper. We also show evidence of a direct correlation between surface grain size and friction coefficient, validating a model linking friction in pure metals and the transition from dislocation mediated plasticity to grain boundary sliding, (C) 2017 Acta Materialia Inc. Published by Elsevier Ltd.

引用

页码：54 / 58

页数：5

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