Optimization of finned heat sinks for impingement cooling of electronic packages

被引：26

作者：

Kondo, Y

Behnia, M

Nakayama, W

Matsushima, H

机构：

[1] Hitachi Ltd, Mech Engn Res Lab, Tsuchiura, Ibaraki 300, Japan

[2] Univ New S Wales, Sch Mech & Mfg Engn, Sydney, NSW 2052, Australia

[3] Univ Maryland, Dept Mech Engn, College Pk, MD 20742 USA

[4] Univ Maryland, Dept Mech Engn, College Pk, MD 20742 USA

来源：

JOURNAL OF ELECTRONIC PACKAGING | 1998年 / 120卷 / 03期

关键词：

D O I：

10.1115/1.2792631

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The study of optimization of finned heat sinks for impingement cooling of electronic components was undertaken. The procedure was based on a semiempirical zonal approach to the determination of thermal resistance as well as pressure drop. To test the validity of the model's predictions, experiments and CFD (computational fluid dynamics) simulations were performed. The results provided support for the approach, The model enables cost-effective design calculations to be performed for the optimization of heat sinks. We performed such calculations to optimize an LSI heat sink in consideration of sixteen design parameters, including fin thickness, fin spacing, fin height, and flow-orifice dimensions. For the particular application considered in our study, the optimum fin thickness was found to be 0.15 mm. The characteristics and limitations of air cooling for such applications were investigated under various conditions.

引用

页码：259 / 266

页数：8