Thermal Stress Simulation of the Surface Grinding

被引:1
作者
Hua Chonglue [1 ]
Wang Guicheng [1 ]
Pei Hongjie [1 ]
Liu Gang [2 ]
机构
[1] Jiangsu Univ, Sch Mech Engn, Zhenjiang, Peoples R China
[2] Shanghai Tool Works Co Ltd, Shanghai, Peoples R China
来源
MANUFACTURING SCIENCE AND TECHNOLOGY, PTS 1-8 | 2012年 / 383-390卷
关键词
grinding; heat source model; simulation; thermal stress; wheel velocity; PREDICTION;
D O I
10.4028/www.scientific.net/AMR.383-390.2211
中图分类号
TP39 [计算机的应用];
学科分类号
081203 ; 0835 ;
摘要
Thermal stresses of grinding plays an important role on the fatigue and wear resistance of the component. A comprehensive analysis of thermal stress induced by surface grinding has been conducted with aid of the finite element method. To obtain a reliable figure of thermal stress induced by grinding, temperature-dependent properties of workpiece materials were taken into account. The developed finite element procedure has also been applied to calculate the surface and sub-surface thermal stress induced by moving source of triangular heat when convection and radiation is occurred over the whole work. Based on an analysis of the effects of wheel velocity on the thermal stress distributions in an elastic-plastic solid, some important conclusions were given.
引用
收藏
页码:2211 / +
页数:2
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