Experimental evidence of copper insertion in a crystallographic structure of Ti3SiC2 MAX phase

被引：25

作者：

Dezellus, Olivier ^{[1
]}

Gardiola, Bruno ^{[1
]}

Andrieux, Jerome ^{[1
]}

Lay, Sabine ^{[2
,3
]}

机构：

[1] Univ Lyon 1, CNRS, UMR 5615, Lab Multimat & Interfaces, F-69100 Villeurbanne, France

[2] Ecole Natl Super Electrochim & Electrome Grenoble, Thermodynam & Physicochim Met Lab, CNRS, SIMAP, F-38402 St Martin Dheres, France

[3] Univ Grenoble Alpes, F-38402 St Martin Dheres, France

来源：

SCRIPTA MATERIALIA | 2015年 / 104卷

关键词：

MAX phase; Copper; Reactivity; Insertion; MICROSTRUCTURE; COMPOSITES; TI2ALC; CU;

D O I：

10.1016/j.scriptamat.2015.03.015

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Chemical interaction of Ti3SiC2 substrate with silver-copper (Ag-Cu) melt is studied after several minutes of contact at 800 degrees C and 900 degrees C. Experimental evidence of Cu insertion into the crystallographic structure of Ti3SiC2 is given both by X-ray energy dispersive spectroscopy (composition is about Ti47Cu8Si13C32) and by electronic diffraction patterns obtained by transmission electronic microscopy for single grains. Moreover, the X-ray diffraction pattern shows that insertion of Cu induces a slight increase in the lattice parameters and a modification of peak intensities. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：17 / 20

页数：4

共 24 条

[1] Elastic and Mechanical Properties of the MAX Phases [J].

Barsoum, Michel W. ;

Radovic, Miladin .

ANNUAL REVIEW OF MATERIALS RESEARCH, VOL 41, 2011, 41 :195-227

[2] The topotactic transformation of Ti3SiC2 into a partially ordered cubic Ti(C0.67Si0.06) phase by the diffusion of Si into molten cryolite [J].

Barsoum, MW ;

El-Raghy, T ;

Farber, L ;

Amer, M ;

Christini, R ;

Adams, A .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1999, 146 (10) :3919-3923

[3]

Barsoum MW, 2001, AM SCI, V89, P334, DOI 10.1511/2001.4.334

[4] Synthesis and characterization of a remarkable ceramic: Ti3SiC2 [J].

Barsoum, MW ;

ElRaghy, T .

JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1996, 79 (07) :1953-1956

[5] Ohmic contact properties of magnetron sputtered Ti3SiC2 on n- and p-type 4H-silicon carbide [J].

Buchholt, K. ;

Ghandi, R. ;

Domeij, M. ;

Zetterling, C-M. ;

Lu, J. ;

Eklund, P. ;

Hultman, L. ;

Spetz, A. Lloyd .

APPLIED PHYSICS LETTERS, 2011, 98 (04)

[6] Wettability of Ti3SiC2 by Ag-Cu and Ag-Cu-Ti melts [J].

Dezellus, O. ;

Voytovych, R. ;

Li, A. P. H. ;

Constantin, G. ;

Bosselet, F. ;

Viala, J. C. .

JOURNAL OF MATERIALS SCIENCE, 2010, 45 (08) :2080-2084

[7]

Dezellus O., 2010, 34 INT C EXP ADV CER

[8] Ti3SiC2-Cu composites by mechanical milling and spark plasma sintering: Possible microstructure formation scenarios [J].

Dudina, Dina V. ;

Mali, Vyacheslav I. ;

Anisimov, Alexander G. ;

Bulina, Natalia V. ;

Korchagin, Michail A. ;

Lomovsky, Oleg I. ;

Bataev, Ivan A. ;

Bataev, Vladimir A. .

METALS AND MATERIALS INTERNATIONAL, 2013, 19 (06) :1235-1241

[9] The rise of graphene [J].

Geim, A. K. ;

Novoselov, K. S. .

NATURE MATERIALS, 2007, 6 (03) :183-191

[10] Microstructural characterization and compression properties of TiC0.61/Cu(Al) composite synthesized from Cu and Ti3AlC2 powders [J].

Huang, Zhenying ;

Bonneville, Joel ;

Zhai, Hongxiang ;

Gauthier-Brunet, Veronique ;

Dubois, Sylvain .

JOURNAL OF ALLOYS AND COMPOUNDS, 2014, 602 :53-57

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