Higher compressive strengths and the Bauschinger effect in conformally passivated copper nanopillars

被引:69
作者
Jennings, A. T. [1 ]
Gross, C. [2 ]
Greer, F. [3 ]
Aitken, Z. H. [1 ]
Lee, S. -W. [1 ]
Weinberger, C. R. [4 ]
Greer, J. R. [1 ]
机构
[1] CALTECH, Div Engn & Appl Sci, Pasadena, CA 91125 USA
[2] Northwestern Univ, Evanston, IL 60208 USA
[3] CALTECH, Jet Prop Lab, Pasadena, CA 91109 USA
[4] Sandia Natl Labs, Albuquerque, NM 87185 USA
基金
美国国家科学基金会; 美国国家航空航天局;
关键词
Dislocation boundaries; Copper; Compression test; Nanostructure; DISCRETE DISLOCATION ANALYSIS; SINGLE-CRYSTALS; MICRO-PILLARS; SIZE; DEFORMATION; PLASTICITY; SIMULATIONS; BEHAVIOR; SCALE; MULTIPLICATION;
D O I
10.1016/j.actamat.2012.03.013
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Our current understanding of size-dependent strength in nano- and microscale crystals is centered around the idea that the overall strength is determined by the stress required to propagate dislocation sources. The nature and type of these dislocation sources is the subject of extensive debate, however, one commonality amongst these theories is that the ability of the free surface to absorb dislocations is a necessary condition for transition to a source controlled regime. In this work we demonstrate that atomic layer deposition (ALD) of conformal 5-25 nm thick TiO2/Al2O3 coatings onto electroplated single crystalline copper pillars with diameters ranging from 75 nm to 1 mu m generally inhibits the ability of a dislocation to vanish at the free surface. Uniaxial compression tests reveal increased strength and hardening relative to uncoated pillars at equivalent diameters, as well as a notable recovery of plastic strain during unloading, i.e. the Bauschinger effect. Unlike previous reports, these coated pillars retained the stochastic signature in their stress strain curves. We explain these observations within the framework of a size-dependent strength theory based on a single arm source model, dislocation theory, and microstructural analysis by transmission electron microscopy. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:3444 / 3455
页数:12
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