Thermomechanical analysis of hotplates by FEM

被引：3

作者：

Vízváry, Z

Fürjes, P

Bársony, I

机构：

[1] Res Inst Tech Phys & Mat Sci MFA, H-1525 Budapest, Hungary

[2] Budapest Univ Technol & Econ, Dept Appl Mech, H-1111 Budapest, Hungary

来源：

MICROELECTRONICS JOURNAL | 2001年 / 32卷 / 10-11期

基金：

匈牙利科学研究基金会;

关键词：

finite element method; gas sensors; thermomechanical analysis;

D O I：

10.1016/S0026-2692(01)00070-2

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper deals with the finite element model for the three-dimensional analysis of thermally isolated hotplates. These hotplates can be used as gas sensors. Our calculations result in the temperature distribution, the stress and displacement field. The stress and displacement fields are calculated from the thermal results (coupled analysis). Calculations were made in different cases of boundary conditions. The results were discussed with respect to the initial experimental findings. The problem is very difficult, hence the present results are qualitative and further examination is needed. (C) 2001 Elsevier Science Ltd. All rights reserved.

引用

页码：833 / 837

页数：5

共 3 条

[1] Porous silicon bulk micromachining for thermally isolated membrane formation [J].