Experimental studies on the dynamic Compressive properties of lead-free solder

In this paper, the quasi-static and dynamic compressive properties of lead-free solders were assessed. Dynamic experiments were conducted using a split Hopkinson pressure bar system at strain rates ranging from 500 to 2000 s(-1). It was found that the lead-free solder 96.3Sn3Ag0.7Cu was sensitive to strain rates, its yield strength and flow stress increased remarkably with the increase of strain rate. Furthermore, Johnson-Cook material model was used to estimate visco-plastic behavior and strain rate sensitivity of the solder. The related parameters in the model were determined according to experimental results. Compared with the typical Pb-containing solder Sn63Pb37, The lead-free solder showed some perfect properties and could be used to substitute some Pb-containing solder in microelectronic components packaging and interconnects.