Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys

被引：97
作者：
Kinyanjui, R
Lehman, LP
Zavalij, L
Cotts, E [1 ]
机构：
[1] SUNY Binghamton, Dept Phys, Binghamton, NY 13902 USA
[2] SUNY Binghamton, Mat Sci Program, Binghamton, NY 13902 USA
来源：
JOURNAL OF MATERIALS RESEARCH | 2005年 / 20卷 / 11期
基金：
美国国家科学基金会;
关键词：
D O I：
10.1557/JMR.2005.0361
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The degree of undercooling of Sri in near eutectic, SnAgCu solder balls upon cooling at a rate of 1 degrees C/s from the melt was examined and found to increase linearly with inverse nominal sample diameter (for balls of radius between 100 and 1000 mu m). The mean undercooling for SnAgCu solder balls in a flip chip assembly was 62 degrees C. The microstructures of these different samples were examined by means of scanning electron microscopy. The Sri dendrite arm width was observed to monotonically increase with ball diameter, indicating a possible dependence of the mechanical response of such solder balls upon size.
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收藏
页码：2914 / 2918
页数：5
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