共 50 条
- [22] STRESS ANALYSIS OF THE LOWER HEAD OF CENTRAL MEASURING SHROUD UNDER THERMAL STRIPING AND THERMAL SHOCK CONDITIONS [J]. PROCEEDINGS OF THE 2020 INTERNATIONAL CONFERENCE ON NUCLEAR ENGINEERING (ICONE2020), VOL 1, 2020,
- [24] Stress simulation in layered wood-based materials under mechanical loading [J]. MATERIALS & DESIGN, 2015, 87 : 1065 - 1071
- [25] INVESTIGATION OF STRESS FIBER AND FOCAL ADHESION EVOLUTION UNDER APPLIED MECHANICAL LOADING [J]. PROCEEDINGS OF THE ASME SUMMER BIOENGINEERING CONFERENCE, PTS A AND B, 2012, : 689 - 690
- [26] Thermal-Mechanical Stress Modeling of Copper Chip-to-Substrate Pillar Connections [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2010, 33 (03): : 621 - 628