Reduction of Base-Collector Capacitance in InP/InGaAs DHBT with Buried SiO2 Wires

被引:0
|
作者
Takebe, Naoaki [1 ]
Miyamoto, Yasuyuki [1 ]
机构
[1] Tokyo Inst Technol, Dept Phys Elect, Tokyo 1528552, Japan
来源
IEICE TRANSACTIONS ON ELECTRONICS | 2012年 / E95C卷 / 05期
关键词
heterojunction bipolar transistor MP; base-collector capacitance; in situ etching;
D O I
10.1587/transele.E95.C.917
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we report the reduction in the base-collector capacitance (C-BC) of InP/InGaAs double heterojunction bipolar transistors with buried SiO2 wires (BG-HBT). In a previous trial, we could not confirm a clear difference between the C-BC of the conventional HBT and that of the BG-HBT because the subcollector layer was thicker than expected. In this study, the interface between the collector and the subcollector was shifted to the middle of the SiO2 wires by adjusting the growth temperature, and a reduction in C-BC with buried SiO2 wires was confirmed. The estimated C-BC of the BG-HBT was 7.6 fF, while that of the conventional HBT was 8.6 fF. This 12% reduction was in agreement with the 10% reduction calculated according to the designed size.
引用
收藏
页码:917 / 920
页数:4
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