共 33 条
[3]
Lumped Dynamic Electrothermal Model of IGBT Module of Inverters
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,
2015, 5 (03)
:355-364
[4]
Bierhoff MH, 2004, IEEE POWER ELECTRON, P2836
[5]
Das S, 2013, PRODUCT SAFETY AND RESTRICTED SUBSTANCES IN APPRAREL, P1, DOI 10.1533/9780857098375
[6]
Das S., 2012, An open architecture for enabling CBM/PHM capabilities in ground vehicles, P1
[7]
Das S.C., 2014, 2014 IEEE 6th India International Conference on Power Electronics (IICPE), P1, DOI DOI 10.1109/ACES.2014.6807996
[8]
Das S, 2016, PROCEEDINGS OF 2016 IEEE INTERNATIONAL CONFERENCE ON DISTRIBUTED COMPUTING, VLSI, ELECTRICAL CIRCUITS AND ROBOTICS (DISCOVER), P1, DOI 10.1109/DISCOVER.2016.7806216
[10]
Drofenik U., 2005, P INT POW EL C NIIG