共 26 条
[4]
Felten J. J., 1978, US Patent, Patent No. [4-070-200, 4070200]
[6]
Garron PE, 1998, MULTICHIP MODULE TEC
[9]
Sensors and packages based on LTCC and thick-film technology for severe conditions
[J].
SADHANA-ACADEMY PROCEEDINGS IN ENGINEERING SCIENCES,
2009, 34 (04)
:677-687
[10]
Micro heat pipes in low temperature cofire ceramic (LTCC) substrates
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2003, 26 (01)
:110-115